 |
|
| If you can't view the Datasheet, Please click here to try to view without PDF Reader . |
|
|
|
| If you can't view the Datasheet, Please click here to try to view without PDF Reader . |
|
|
| Datasheet File OCR Text: |
| product structure : silicon monolithic integrated circuit this product has no designed protec tion against radioactive rays 1/72 19.jun.2017 rev.003 tsz22111 ? 14 ? 001 ? 2016 rohm co., ltd. all rights reserved. www.rohm.com tsz02201-0e3e0hz00650-1-2 multiple input switch monitor lsi for automotive BD3375MUV-M general description BD3375MUV-M is a 22-channel multiple input switch monitor ic that detects the opening and closing of mechanical switches. once it senses a change in the status of a switch, it sends an interrupt signal to the mcu via a serial peripheral interface (spi). the 22 switch inputs have two types of power supply, vpub and vpua. the vpub and the vpua power supplies can either be from a battery or from another power supply system. vpub is the supply for the inb inputs while vpua is for the inz and ina inputs. BD3375MUV-M has two modes of operation, normal and sleep. in both modes, the internal registers can be set to make the device perform either intermittent or continuous monitoring of the switches. in intermittent monitoring, th e switch status is monitored at regular time intervals, allowing the ic to operate with low power consumption. also, operation with reduced noise can be achieved by enabling uniform sequential monitoring of all switches or sequential monitoring by power supply system. application ? body control module key specifications ? fully functional voltage range: 8v to 26v ? switch input voltage range: -14v to +40v ? selectable wetting current (min): 1ma, 3ma, 5ma, 10ma, 15ma specifications ? aec-q100 qualified (note 1) ? operational voltage range: 3.9v to 8v ? uses 3.3/5.0v spi protocol in communicating with the mcu ? serial communication error checking through 8bit-crc ? thermal shutdown protection (tsd) ? power on reset (por) ? selectable source/sink curr ent levels through register settings ? wetting current timer capability ? 8 source or sink input terminals ? 14 source input terminals ? separable power supply vpua: 16ch (ina&inz), vpub: 6ch (inb) ? interrupt notification upon switch status change ? 1 to 6 times matched lpf that eliminates input terminal noise ? low current consumption (intermittent monitoring) ? status display of selected terminal at dmux terminal (note 1) grade 1 package w(typ) x d(typ) x h(max) vqfn48mcv070 7.00mm x 7.00mm x 1.00mm (48 pin qfn) typical application circuit figure 1. typical application circuit inz0 ina0 vpub sclk si wakeb vpua gnd intb so csb BD3375MUV-M +b watchdog reset mcu sclk cs so intb vin vpua/vpub vpua/vpub inz7 ina7 inb0 inb5 vpua/+b' vpua +b' io dmux vddi ref5 lvdd avdd 4.7 0.1 0 40 ? 0.1 0 40 ? 0.1 0 40 ? 0.1 0 40 ? 0.1 0 40 ? 0.1 0 40 ? 0.1 0.1 0.1 10k 100k ? vout1 vout2 dcdc vin si enable test datashee t
datasheet d a t a s h e e t 2/72 tsz22111 ? 15 ? 001 ? 2016 rohm co., ltd. all rights reserved. www.rohm.com 19.jun.2017 rev.003 tsz02201-0e3e0hz00650-1-2 BD3375MUV-M pin configuration figure 2. pin configuration (top view) datasheet d a t a s h e e t 3/72 tsz22111 ? 15 ? 001 ? 2016 rohm co., ltd. all rights reserved. www.rohm.com 19.jun.2017 rev.003 tsz02201-0e3e0hz00650-1-2 BD3375MUV-M pin description table 1. pin description (1) pin no. pin name function description equivalent circuit diagram (note 2) 1 gnd ground ground pin -- 2 intb output open-drain interrupt output pin to the mcu (with an internal pull-up resistor) c 3 n.c. - no connection -- 4 vddi input power supply pin for csb, si, sclk, so, intb and dmux -- 5 n.c. - no connection -- 6 so output spi data out put pin to the mcu h 7 si input spi control data input pin from the mcu (with an internal pull-down resistor) a 8 sclk input spi control clock input pin from the mcu (with an internal pull-down resistor) a 9 csb input spi control chip select input pin from the mcu (with internal pull-up current source) b 10 dmux output digital multiple xer for switch input output pin g 11 test input test mode control pin (n o t e 3) j 12 gnd ground ground -- 13 n.c. - no connection -- 14 lvdd input power supply input pin for the logic block (n o t e 4) -- 15 ref5 output 5v power supply output pin (n o t e 4) i 16 avdd input power supply input pin for the analog block (n o t e 4) -- 17 n.c. - no connection -- 18 inb0 input switch input pin 0 under vpub power supply system (with an internal pull-up current source) f 19 inb1 input switch input pin 1 under vpub power supply system (with an internal pull-up current source) f 20 inb2 input switch input pin 2 under vpub power supply system (with an internal pull-up current source) f 21 inb3 input switch input pin 3 under vpub power supply system (with an internal pull-up current source) f 22 inb4 input switch input pin 4 under vpub power supply system (with an internal pull-up current source) f 23 inb5 input switch input pin 5 under vpub power supply system (with an internal pull-up current source) f 24 gnd ground ground -- (note 2) ref. page 66 and page 67 io equivalent circuit. (note 3) short test pin to ground when mounted. (note 4) short ref5 pin to avdd pin and lvdd pin, and connect a 4.7f capacitor between it and ground. do not use it as voltage source to another ic. datasheet d a t a s h e e t 4/72 tsz22111 ? 15 ? 001 ? 2016 rohm co., ltd. all rights reserved. www.rohm.com 19.jun.2017 rev.003 tsz02201-0e3e0hz00650-1-2 BD3375MUV-M table 2. pin description (2) pin no. pin name function description equivalent circuit diagram (note 2) 25 gnd - no connection -- 26 vpub input power supply input pin for the main system and inb switches -- 27 vpub input power supply input pin for the main system and inb switches -- 28 ina0 input switch input pin 0 under vpua power supply system (with an internal pull-up current source) f 29 ina1 input switch input pin 1 under vpua power supply system (with an internal pull-up current source) f 30 ina2 input switch input pin 2 under vpua power supply system (with an internal pull-up current source) f 31 ina3 input switch input pin 3 under vpua power supply system (with an internal pull-up current source) f 32 ina4 input switch input pin 4 under vpua power supply system (with an internal pull-up current source) f 33 ina5 input switch input pin 5 under vpua power supply system (with an internal pull-up current source) f 34 ina6 input switch input pin 6 under vpua power supply system (with an internal pull-up current source) f 35 ina7 input switch input pin 7 under vpua power supply system (with an internal pull-up current source) f 36 gnd ground ground -- 37 n.c. - no connection -- 38 vpua input power supply input pin for ina and inz switches -- 39 vpua input power supply input pin for ina and inz switches -- 40 inz0 input switch input pin 0 under vpua power supply system (with an internal pull-up/down current source) e 41 inz1 input switch input pin 1 under vpua power supply system (with an internal pull-up/down current source) e 42 inz2 input switch input pin 2under vpua power supply system (with an internal pull-up/down current source) e 43 inz3 input switch input pin 3 under vpua power supply system (with an internal pull-up/down current source) e 44 inz4 input switch input pin 4 under vpua power supply system (with an internal pull-up/down current source) e 45 inz5 input switch input pin 5 under vpua power supply system (with an internal pull-up/down current source) e 46 inz6 input switch input pin 6 under vpua power supply system (with an internal pull-up/down current source) e 47 inz7 input switch input pin 7 under vpua power supply system (with an internal pull-up/down current source) e 48 wakeb output open-drain output pi n to monitor the mode of operation (n o t e 5) d (note 5) in the application circuit, wakeb should be pulled-up by an external resistor. datasheet d a t a s h e e t 5/72 tsz22111 ? 15 ? 001 ? 2016 rohm co., ltd. all rights reserved. www.rohm.com 19.jun.2017 rev.003 tsz02201-0e3e0hz00650-1-2 BD3375MUV-M block diagram figure 3. block diagram ?>>>?>? ?>?>? ?>e>e>? ?>e>e>? >?>>?> ?( >?>>?> >?>>> ?( >?>>>? >?>?> ?( >?>?>? >???? ? ? ? ? ?? ? ?>>????? vpua vpua >?? ????? ? ?? ? ??? ?? ?> >???!? >>e??#? >?????>>????? ?>>>?>?>>???? ? ?? >?>? >?>>???? ? ?? >?>e>e ?>e>e>? sclk >?>? so csb intb gnd x8 >?>e>e >??>e>e 40 a >??? ?? ?>>??? ?? ?? ?? ? ?? >t???? ? ?? ? >??? ?? ?"? ? ? ???? >y>?>?>?>>?>y>>?>y>?> (min) >y>?>?>?>>?>y>>?>y>?> (min) >???? ? ? ? ? ?? vpua x8 vpua >???? ? ? ? ? ?? vpub x6 vpub >??? ?!? >e???? ? ?>>??? ?? ?>e>e>? ref5 lvdd avdd + - ? ?>>????? + - >?>?>? >y>?>?>?>>?>y>>?>y>?> (min) ? ?>>????? + - >y>?>?>?>>?>y>>?>y>?> (min) >e>??>>???? ? ?? ?>e>e>? >e>?? >?>e>e >?>e>e >?>e>e >?>e>e >?>e>e >??#?? >>??> >t?? ?? ?>t>?>> >??? ?? ?? ? >??!? ? ??% ?>?> >?>e>e >?>?>? >?>e>e >?>?>? >?>e>e tes t datasheet d a t a s h e e t 6/72 tsz22111 ? 15 ? 001 ? 2016 rohm co., ltd. all rights reserved. www.rohm.com 19.jun.2017 rev.003 tsz02201-0e3e0hz00650-1-2 BD3375MUV-M absolute maximum ratings table 3. pin description parameter symbol ratings unit supply voltage range on pin vddi, avdd, lvdd input voltage range on pin csb, si, sclk, test output voltage range at pin so, intb, dmux, ref5 - -0.3 to +7.0 v supply voltage range on pin vpua, vpub voltage range on pin wakeb - -0.3 to +40 v input current at pin wakeb - 10 ma input voltage on switch pin (inb0-inb5, ina0-ina7,inz0-inz7) - -14 to +40 v operating temperature range t opr -40 to +125 c storage temperature range t str -55 to +150 c maximum junction temperature tj -40 to +150 c caution: operating the ic over the absolute maximum ratings may damage t he ic. the damage can either be a short circuit between pins or an open circuit between pins and the internal circuitry. therefore, it is import ant to consider circuit protection measures, such as adding a f use, in case the ic is operated over the absolute maximum ratings. datasheet d a t a s h e e t 7/72 tsz22111 ? 15 ? 001 ? 2016 rohm co., ltd. all rights reserved. www.rohm.com 19.jun.2017 rev.003 tsz02201-0e3e0hz00650-1-2 BD3375MUV-M thermal resistance (note 6) table 4. thermal resistance parameter symbol thermal resistance (typ) unit 1s (note 8) 2s2p (note 9) vqfn48mcv070 junction to ambient ja 83.3 24.5 c/w junction to top characterization parameter (note 7) jt 8 5 c/w (note 6) based on jesd51-2a(still-air) (note 7) the thermal characterization parameter to report the di fference between junction temperature and the temperature at th e top center of the outside surface of the component package. (note 8) using a pcb board based on jesd51-3 (table 5). (note 9) using a pcb board based on jesd51-5, 7 (table 6). table 5. 1s layer number of measurement board material board size single fr-4 114.3mm x 76.2mm x 1.57mmt top copper pattern thickness footprints and traces 70 m table 6. 2s2p layer number of measurement board material board size thermal via (note 10) pitch diameter 4 layers fr-4 114.3mm x 76.2mm x 1.6mmt 1.20mm - 0.30mm top 2 internal layers bottom copper pattern thickness copper patte rn thickness copper pattern thickness footprints and traces 70 m 74.2mm x 74.2mm 35 m 74.2mm x 74.2mm 70 m (note 10) this thermal via connects with the copper pattern of all layers. recommended operating conditions table 7. recommended operating conditions parameter symbol ratings unit min max operating temperature t opr -40 +125 c vpua/vpub supply voltage v vpux 8.0 26 v vddi supply voltage v vddi 3.1 5.25 v capacitance for ref5 (note 11) c ref 4.7 - f (note 11) recommend a ceramic capacitance. pl ease consider variation of capacitance. datasheet d a t a s h e e t 8/72 tsz22111 ? 15 ? 001 ? 2016 rohm co., ltd. all rights reserved. www.rohm.com 19.jun.2017 rev.003 tsz02201-0e3e0hz00650-1-2 BD3375MUV-M electrical characteristics spec conditions: 8.0v ? vpua/vpub ? 26v, 3.1v ? vddi ? 5.25v, -40c ? t opr ? +125c vpua/vpub/inz/ina/inb terminal: resist ors and capacitors are not connected ref5 terminal: 4.7f unless otherwise specified, the typical condition is vpua/vpub=13v, vddi=5.00v, t opr =25c. table 8. recommended operating conditions parameter symbol/nam e min typ max unit vpua/vpub supply voltage low -voltage operating range (note 12) fully operational voltage range high-voltage operating range (note 13) v vpux(qfl) v vpux(fo) v vpux ( qfh ) 3.9 8.0 26 - - - 8.0 26 40 v por(power on reset) activation voltage (n o t e 14 ) v por ( low ) 3.9 4.2 4.5 v por(power on reset) deactivation voltage (n o t e 14 ) v por ( high ) 4.0 4.3 4.6 v vpua/vpub operating current continuous monitoring current source is invalid, ?hi-z? status i vpux(off) - - 600 a vpua/vpub average operating current intermittent monitoring source/sink current setting=1ma monitoring period=50ms, strobe time=125s i vpux(ss) - 75 100 a vddi operating current intb=?h?, csb=?h? i vddi - 5 10 a ref5 output voltage v ref5 4.75 5.00 5.25 v (note 12) electrical characteristics are not guaranteed though function s are operating. por is active between 3.9v and 4.5v. (note 13) electrical characteristics are not guaranteed though functions are operating. (note 14) the por circuit monitors the ref5 voltage. datasheet d a t a s h e e t 9/72 tsz22111 ? 15 ? 001 ? 2016 rohm co., ltd. all rights reserved. www.rohm.com 19.jun.2017 rev.003 tsz02201-0e3e0hz00650-1-2 BD3375MUV-M table 9. electrical characteristics (switch input) parameter symbol/nam e min typ max unit source current 1 (internal pull-up current source) 0v external supply, vpua/vpub system (1ma setting) i source1 1.0 1.4 1.8 ma sink current 1 (internal pull-down current source) 8v external supply, vpu a system (1ma setting) i sink1 1.0 1.4 1.8 ma source current 2 (internal pull-up current source) 0v external supply, vpua/vpub system (3ma setting) i source3 3.0 4.2 5.4 ma sink current 2 (internal pull-down current source) 8v external supply, vpu a system (3ma setting) i sink3 3.0 4.2 5.4 ma source current 3 (internal pull-up current source) 0v external supply, vpua/vpub system (5ma setting) i source5 5.0 7.0 9.0 ma sink current 3 (internal pull-down current source) 8v external supply, vpu a system (5ma setting) i sink5 5.0 7.0 9.0 ma source current 4 (internal pull-up current source) 0v external supply, vpua/vpub system (10ma setting) i source10 10.0 14.0 18.0 ma sink current 4 (internal pull-down current source) 8v external supply, vpua system (10ma setting) i sink10 10.0 14.0 18.0 ma source current 5 (internal pull-up current source) 0v external supply, vpua/vpub system (15ma setting) i source15 15.0 21.0 27.0 ma sink current 5 (internal pull-down current source) 8v external supply, vpua system (15ma setting) i sink15 15.0 21.0 27.0 ma low to high switch detection threshold voltage (3.0v setting) v th3(high) 2.7 3.0 3.3 v high to low switch detection threshold voltage (3.0v setting) v th3(low) 2.6 2.9 3.2 v low to high switch detection threshold voltage (4.0v setting) v th4(high) 3.7 4.0 4.3 v high to low switch detection threshold voltage (4.0v setting) v th4(low) 3.6 3.9 4.2 v datasheet d a t a s h e e t 10/72 tsz22111 ? 15 ? 001 ? 2016 rohm co., ltd. all rights reserved. www.rohm.com 19.jun.2017 rev.003 tsz02201-0e3e0hz00650-1-2 BD3375MUV-M table 10. electrical characteristics (static electrical characteristics) parameter symbol/nam e min typ max unit serial interface threshold voltage (n o t e 15 ) v inlogic 0.8 - 2.2 v csb input current csb=vddi i cs(high) -10 - +10 a csb pull-up current csb=0v i cs(low) 30 - 85 a si, sclk pull-down resistor r si , r sclk 50 100 150 k si, sclk input current si, sclk=0v i si(low) , i sclk(low) -10 - +10 a so ?h? level output voltage i source =200a v sc(high) v vddi -0.8 - v vddi v so ?l? level output voltage i sink =1.6ma v so(low) - - 0.4 v so(set to ?hi-z?) input current 0v to vddi i so(tri) -10 - +10 a dmux ?h? level output voltage i source =200a v dmux(high) v vddi -0.8 - v vddi v dmux ?l? level output voltage i sink =1.6ma v dmux(low) - - 0.4 v intb internal pull-up current (n o t e 16) i intb ( pu ) 15 53 85 a intb ?h? level output voltage intb=open v intb(high) v vddi -0.5 - v vddi v intb ?l? level output voltage i sink =1.0ma v intb(low) - 0.2 0.4 v wakeb ?l? level output voltage wakeb=1.0ma v wakeb(low) - 0.2 0.4 v wakeb (set to ?hi-z?) input current 0v to vpub i wakeb(tri) -10 - +10 a (note 15) applicable to sclk, si, csb (note 16) vddi= 5.0v datasheet d a t a s h e e t 11/72 tsz22111 ? 15 ? 001 ? 2016 rohm co., ltd. all rights reserved. www.rohm.com 19.jun.2017 rev.003 tsz02201-0e3e0hz00650-1-2 BD3375MUV-M table 11. electrical characteristics (dynamic electrical characteristics) parameter symbol/nam e min typ max unit wetting current timer counting starts after n-times detection of matched lpf t wct 13 - 22 ms interrupt delay time1 time from switch status ch ange to intb output change in continuous monitoring t intb_dly1 - - 1 ms interrupt delay time 2 time from switch status ch ange to intb output change in intermittent monitoring n: setting time of lpf matched n times t intb_dly2 - - [monitor cycle] x n+1 ms interrupt clear time time from csb rising edge to intb output change t intb_clr - - 150 s command set time time from csb rising edge to setting of register t reg_en - - 150 s transition time to normal mode time from csb rising edge to wakeb output change t wakeb_dly1 - - 1 ms transition time to sleep mode time from csb rising edge to wakeb output change t wakeb_dly2 - - 1 ms switch strobe time (93.75s setting) (n o t e 1 7 ) t scan _ 94 84.375 93.75 103.125 s switch strobe time (125s setting) (n o t e 17 ) t scan _ 125 112.5 125 137.5 s switch strobe time (187.5s setting) (n o t e 1 7 ) t scan _ 188 168.75 187.5 206.25 s switch strobe time (250s setting) (n o t e 1 7 ) t scan _ 250 225 250 275 s source/sink current rise time fsq=?0?, fsqz/a/b=?0?, 10ma setting load resistance 100 t sr_r - 20 (note 18) - s source/sink current fall time fsq=?0?, fsqz/a/b=?0?, 10ma setting load resistance 100 t sr_f - 15 (note 18) - s internal clock accuracy t timer -10 - +10 % (note 17) ?h? width of internal signal (ref. page 12 figure 6). (note 18) reference value. datasheet d a t a s h e e t 12/72 tsz22111 ? 15 ? 001 ? 2016 rohm co., ltd. all rights reserved. www.rohm.com 19.jun.2017 rev.003 tsz02201-0e3e0hz00650-1-2 BD3375MUV-M table 12. electrical characteristics (digital interface characteristics) parameter symbol/nam e min typ max unit sclk frequency f sclk - - 4.4 mhz setup time from csb fall to sclk rise t lead 100 - 1000 ns setup time from sclk fall to csb rise t lag 50 - 500 ns setup time from si to sclk fall t si ( su ) 16 - - ns hold time from sclk fall to si t si ( hold ) 20 - - ns si, csb, sclk rise time t r ( si ) - 5.0 ( n o t e 19 ) - ns si, csb, sclk fall time t f ( si ) - 5.0 ( n o t e 19 ) - ns time from csb fall to so output low impedance t so ( en ) - - 55 ns time from csb rising to so output high impedance t so ( dis ) - - 55 ns sclk ?h? level width t sclkh 75 - - ns sclk ?l? level width t sclkl 75 - - ns time from sclk rise to stable so data output so cl=20pf t valid - 25 55 ns csb ?h? level time t csbh 150 - - s (note 19) reference value. timing chart serial access timing figure 4. serial access timing msb 0.2v vddi 0.7v vddi 0.2v vddi 0.7v vddi 0.2v vddi msb 0.2v vddi 0.7v vddi lsb csb sclk si so hi-z hi-z t sclkh t sclkl t valid t so(dis) t lag t lead t si(su) t si(hold) t so(en) t r(si) t f(si) datasheet d a t a s h e e t 13/72 tsz22111 ? 15 ? 001 ? 2016 rohm co., ltd. all rights reserved. www.rohm.com 19.jun.2017 rev.003 tsz02201-0e3e0hz00650-1-2 BD3375MUV-M power supply rising/falling sequence figure 5. power supply rising/falling sequence source/sink current rise and fall time figure 6. intermittent monitoring enabled (fsq=0, fsqz/a/b =0, cmb/a/z=1), source/sink current rise and fall time t intb_clr t reg_en t intb_dly 1 l 0ma l csb internal reference current source intb current source activation command i sink/source vd d i 0v 0v v por(high) por clear vpu b avd d /l vd d (supplied ref5) por v por(low) 8v ref5 null command t intb_clr t reg_en switch-on switch-off external switch undefined output current off output current on inb, ina, inz current t sr_r internal signal scan point 20% 20 % 80% 80 % i sink/source t sr_f external signal strobing time t scan_94,125,188,250 waveform datasheet d a t a s h e e t 14/72 tsz22111 ? 15 ? 001 ? 2016 rohm co., ltd. all rights reserved. www.rohm.com 19.jun.2017 rev.003 tsz02201-0e3e0hz00650-1-2 BD3375MUV-M [basic operation 1] detection of switch status change (continuous monitoring) upon detection of a change in sw itch status, interrupt (intb=?h? ?l?) occurs and the ic requests serial communication with the mcu. < example of recommended operation sequence > figure 7. basic operation 1 q after power is turned on, interrupt (intb=?l?) occurs. r by serial communication, the switch status is obtained by the mcu at csb falling edge. s since the current source is off, the switch termi nal is ?hi-z?, and the output of so is undefined. t internal reference current source is activated u switch status is output by so. v interrupt is cleared (intb=?l? : ?h?) by csb rising edge and prepares for switch change. w switch change occurs (off : on) and ic detects switch status change. x interrupt (intb=?h? : ?l?) is notified to mcu, and serial communication is requested y by serial communication, switch status is obtained by the mcu at csb falling edge. z switch status is output by so. { interrupt is cleared (intb=?l? : ?h?) by csb rising edge and prepares for switch change. | switch change occurs (on : off) and ic detects switch status change. } interrupt (intb=?h? : ?l?) is notified to mcu, and serial communication is requested ~ by serial communication, the switch status is obtained by the mcu at csb falling edge. switch status is output by so. ? interrupt is cleared (intb=?l? : ?h?) by csb rising edge and prepares for switch change. ? power is turned off. 1ms or less initial interrupt status (intb=l) , 1 7 % , q w h u u x s w r f f x u v interrupt occurs interrupt occurs source/sink ? current ? source valid setting command & 6 % >& 9 d o l g v h w w l q j 6 2 ( [ w h u q d o v z l w f k 6 z l w f k 2 ) ) 6 z l w f k 2 1 6 z l w f k 2 ) ) , q w h u q d o u h i h u h q f h f x u u h q w v r x u f h 6 z l w f k w h u p l q d o f x u u h q w q wx |} ? ? rs t u v yz { ~ indefinite n orma l ? mo d e switch ? status ? output switch ? status ? output switch ? status ? output null command null ? command null ? command datasheet d a t a s h e e t 15/72 tsz22111 ? 15 ? 001 ? 2016 rohm co., ltd. all rights reserved. www.rohm.com 19.jun.2017 rev.003 tsz02201-0e3e0hz00650-1-2 BD3375MUV-M [basic operation 2] detection of switch status change (intermittent monitoring) when intermittent monitoring is enabled, switch status is monito red by periodically turning the current source on and off. intermittent monitoring allows low power consumption. < example of recommended operation sequence > figure 8. basic operation 2 q after power is turned on, interrupt (intb=?l?) occurs. r by serial communication, the switch status is obtained by the mcu at csb falling edge. s since the current source is off, the switch termi nal is ?hi-z?, and the output of so is undefined. t interrupt is cleared (intb=?l? : ?h?) by csb rising edge and prepares for switch change. u by serial communication, switch status is obtained by the mcu at csb falling edge. v since the current source is off, the switch termi nal is ?hi-z?, and the output of so is undefined. w ic gets the switch status wh en the current source is on. x interrupt (intb=?h? : ?l?) is notified to mcu, and serial communication is requested y by serial communication, switch status is obtained by the mcu at csb falling edge. z switch status is output by so. { ic detects switch status change. | interrupt is cleared (intb=?l? : ?h?) by csb rising edge and prepares for switch change. } ic detects switch status change. ~ interrupt (intb=?h? : ?l?) is notified to mcu, and serial communication is requested by serial communication, switch status is obtained by the mcu at csb falling edge. ? switch status is output by so. ? interrupt is cleared (intb=?l? : ?h?) by csb rising edge and prepares for switch change. ? power is turned off. , q l w l d o l q w h u u x s w v w d w x v , 1 7 % / , 1 7 % normal mode sink/source current source setting command valid setting command null ? command & 6 % (intermittent monitor setting ) (valid setting) external sw itch 6 z l w f k 2 ) ) 6 z l w f k 2 1 6 z l w f k 2 ) ) internal reference current source sw itch term inal current qwxz ? 6 2 r s t u v y {| } ~ ? ? interrupt ? occurs ? null ? command interrupt ? occurs ? interrupt ? occurs ? interrupt ? occurs ? normal ? mode indefinite indefinite switch ? status ? output switch ? status ? output 1ms ? or ? less null ? command switch ? status ? output 1ms ? or ? less datasheet d a t a s h e e t 16/72 tsz22111 ? 15 ? 001 ? 2016 rohm co., ltd. all rights reserved. www.rohm.com 19.jun.2017 rev.003 tsz02201-0e3e0hz00650-1-2 BD3375MUV-M [basic operation 3] sleep mode operation (manual transition) when mdc register of monitor mode transition command is set to ?1?, mode is changed to sleep. when mdc register of monitor mode transition command is set to ?0?, mode is changed to normal. during sleep mode, wakeb is in ?hi-z? state and its vo ltage level is the level of the external pull-up. < example of recommended operation sequence > figure 9. basic operation 3 q monitor mode transition command (sleep mode setting) is received from mcu. r transition to sleep mode. s switch change occurs (off : on). t ic detects switch status change. u ic informs mcu the interrupt (intb=?h? : ?l?) and switch status is output by so. v monitor mode transition command (normal mode setting) is received from mcu. w transition to normal mode. intb 1ms(max) 1ms(max) wakeb sleep mode mon it or mode monitor mode transition command transition command csb (sleep setting) (normal setting) so sw itch status output sw itch status output exte rnal sw itch sw itch-off sw itch-on internal reference current source sw itch terminal current monitor period set in sleep mode operates d hzd d! d$hzd% interrupt occurs d"d# normal mode sleep mode normal node datasheet d a t a s h e e t 17/72 tsz22111 ? 15 ? 001 ? 2016 rohm co., ltd. all rights reserved. www.rohm.com 19.jun.2017 rev.003 tsz02201-0e3e0hz00650-1-2 BD3375MUV-M [basic operation 4] sleep mode operation (automatic transition to normal mode) automatic transition from sleep mode to normal mode when a sw itch status changes is possi ble when the automatic mode transition setting is enabled. during sleep mode, wakeb is in ?hi-z? state and its vo ltage level is the level of the external pull-up. < example of recommended operation sequence > figure 10. basic operation 4 q automatic transition of mode is enable. r monitor mode transition command (sleep mode setting) is received from mcu. s transition to sleep mode. t switch change occurs (off : on). u ic detects switch status change. v ic informs the interruption to mcu with intb(?h? : ?l?) and changes to normal mode automatically. intb interrupt occurs 1ms ( ma x ) 1ms ( ma x ) wakeb sleep mode automatic mode transition monitor mode valid setting command transition command csb (valid transition) (sleep setting) so sw itch status output sw itch status output external sw itch sw itch-off sw itch-on internal reference current source sw itch terminal current monitor period set in sleep mode operates d hzd! d" d#d$ d normal mode sleep mode normal mode datasheet d a t a s h e e t 18/72 tsz22111 ? 15 ? 001 ? 2016 rohm co., ltd. all rights reserved. www.rohm.com 19.jun.2017 rev.003 tsz02201-0e3e0hz00650-1-2 BD3375MUV-M description of functions 1. power on reset (por) upon the application of an external voltage to vpub, ref5 output is generated by the ldo inside the ic. when ref5 ? 4.2(typ), por is activated. when ref5 ? 4.3(typ), por is deactivated. 2. serial interface communication between BD3375MUV-M and the mcu uses terminals ch ip select bar input (csb), serial clock input (sclk), serial data input (si), and serial data output (so). csb is internally pulled-up to vddi. when csb status is ?0 ?, sclk and si inputs are valid, and it is possible to read data from so. when csb status is ?1?, sclk and si inputs are invalid, and so status is ?hi-z?. communication frame the transmitted frame by the mcu is a 40-bi t structure composed of the transmission and reception discrimination (2-bit), the address (6-bit), the data ( 24-bit), and the crc (8-bit). the transmission and re ception discrimination (2-bit) is intended to differentiate between the transmitted and the received frame. the command (6-bit) sets various settings such as the ?valid interrupt setting command?. the crc (8-bit) out puts the result of a 39 to 8 bit crc calc ulation. if a crc error occurs, either when the structure of the fram e is not 40-bit or when the transmission and re ception discrimination bit is an error (the 33-bit of the so frame is ?h?), communication erro r is output and data is not recognized. as for writing, si data is latched by intern al shift register at timing of sclk falling. table 13. serial data input (si) the received frame by the mcu has two types of bit alignm ent, ?switch status output? a nd ?register value output?. the switch status output bit al ignment is a 40-bit structure co mposed of transmission and recept ion discrimination (2-bit), a fixed value (1-bit), interrupt fa ctor output (5-bit), anot her fixed value (1-bit), mode status output (1-bit), switch status ou tput (22-bit), and crc (8-bit). transmission and reception discrimination (2-bit) is intended to discriminate transmit and receive frame. the interrupt factor is discussed on page 19. when an interrupt factor occurs, the corre sponding bit becomes ?1?. mode status (1-bit) is ?0? when set to normal mode, and it is ?1? when set to sleep mode. switch st atus output (22-bit) is ?1? when external switch is on, and it is ?0? when external switch is off. the crc (8-bit) outputs the result of a 39 to 8 bit crc calculation. the switch status is latched to the ti ming of csb falling edge. the then in order of interrupt factor output, mode status and switch status output are output from so by sclk rising. table 14. serial data output (so-switch status output) the register value output bit alignment is a 40-bit structure composed of transmissi on and reception discrimination (2-bit), a fixed value (1-bit), interrupt fa ctor output (5-bit), register va lue output (24-bit), and crc (8-bit). the data is output by so at sclk's rising edge after the csb falling edge of the command following the register value output command. the bit alignment of the register value output is shown on t able 37. the sequence of register value output is shown in figure 11 and figure 12. table 15. serial data output (so-register value output) 22 21 20 16 32 31 33 39 38 37 36 35 34 98 29 26 25 30 27 setting data 28 24 10 14 13 12 crc 7-0 communication frame si input bit 23 setting data 19 18 17 15 register address 11 switch inb5-0 status output switch ina7-0 s tatus output switch inz7-0 s tatus output 25 24 output frame 3938373635 29282726 34 33 32 so output bit 1 0 0 interrupt factor output 0 31 30 23 22 21 20 19 18 17 16 15 14 13 12 7-0 crc 11 10 9 8 mo d e 1 0 interrupt factor output 0 37 crc 7-0 26 23 98 35 16 11 27 25 24 output fram e 39 38 29 28 31 19 13 12 18 17 20 so output bit 30 36 34 33 32 10 15 14 register value output 22 21 register value output datasheet d a t a s h e e t 19/72 tsz22111 ? 15 ? 001 ? 2016 rohm co., ltd. all rights reserved. www.rohm.com 19.jun.2017 rev.003 tsz02201-0e3e0hz00650-1-2 BD3375MUV-M the register value output command (table 38 rier to rmdr) is used to read-back the register value written by register write command (table 37 ier to mdr). figure 11 describes the single read-back sequence. fi gure 12 describes the continuous read-back sequence. datasheet d a t a s h e e t 20/72 tsz22111 ? 15 ? 001 ? 2016 rohm co., ltd. all rights reserved. www.rohm.com 19.jun.2017 rev.003 tsz02201-0e3e0hz00650-1-2 BD3375MUV-M 4. interrupt (intb operation) there are five interrupt factors that cause the intb terminal to output an ?l?. the type of inte rrupt factor that occurred can be checked in the so output when csb is ?l?. intb output will return to ?h? once the in terrupt factor is cleared by the rising edge of csb. the intb terminal is an open-drain output that is internally pulled-up to vddi. interrupt factors the interrupt factors are shown below: interrupt factor interrupt flag (so output) flag name q test detection so output bit [36] : ?test_flg? r thermal shutdown detection so output bit [35] : ?them_flg? s reset detection so output bit [34] : ?rst_flg? t communication error detection so output bit [33] : ?err_flg? (crc error, 40-bit frame error, or transmission and reception discrimination error) u switch status change detect ion so output bit [32] : ?sw_flg? q test detection the ic generates an interrupt after a transition to test mode. the test terminal should always be connected to ground. r thermal shutdown detection interrupt occurs when the thermal shutdown circuit detec ts a temperature higher than the allowable junction temperature inside ic. s reset detection interrupt occurs after the activation of power on reset (por) or the transmission of the reset command. upon por activation, the so output interrupt flag ?rst_flg? is reflec ted instantly. with reset command transmission, ?rst_flg? is reflected on the next command transmission. t communication error detection interrupt occurs due to either a crc error, a 40-bit fram e error, or a command transmission error. the interrupt flag ?err_flg? is triggered by the following: crc error : when there is a cyclic redundancy check error 40-bit frame error : when the command received is not 40-bit transmit and receive determination error : when the first tw o bits of the command received is not [39:38]=?01? u switch status change detection interrupt occurs when switch a status changes (switch-on : off or switch-off : on). clearing of intb output and interrupt factor the intb ?l? output and the interrupt fa ctor are both cleared by the csb rising edge during command transmission. in case a new interrupt factor occurs during command transmission, the in terrupt factor is not cleared. the new interrupt factor is reflected on the next command transmission. the interrupt factor is not cleared by the register r eadout that follows the regi ster value output command. datasheet d a t a s h e e t 21/72 tsz22111 ? 15 ? 001 ? 2016 rohm co., ltd. all rights reserved. www.rohm.com 19.jun.2017 rev.003 tsz02201-0e3e0hz00650-1-2 BD3375MUV-M 5. operating modes BD3375MUV-M has two types of operating m ode, the normal and the sleep mode. tr ansition between the two modes can be done by sending the correct ?monitor mode transition command? . the current mode of operation can be checked through the wakeb and the so terminal outputs. monitor mode transition register address (0x4f): bit [31]: 0=normal mode, 1=sleep mode) normal mode normal mode operation can be set to continuous monitoring, wher ein the switch status is checked by a continuously on current source, or to intermittent monitoring, wherein the swit ch status is checked by a regularly on/off current source. the period of intermittent monitoring (note 20) can be set according to power supply system while strobe time (note 21) is common for all switch terminals. at normal mode, wakeb is ?l? and the 30-bit of the so output is ?0?. sleep mode sleep mode operation, like in normal mode, can be set to continuous monitoring or intermittent monitoring. the monitoring period (note 20) of intermittent monitoring can be set according to power supply system. the strobe time (note 21) is common for all switch terminals and both modes. the difference with normal mode is that, from sleep mode, it is possible to change to normal mode automatically when interrupt occurs. (automatic mode transition function) at sleep mode, wakeb is in ?hi-z? state and its voltage level is the level of the exte rnal pull-up. the 30-bit of so output is ?1? at sleep mode. (note 20) monitor period (note 21) strobe time figure 13 . intermittent monitoring 6. automatic mode transition function by sending the ?automatic mode transition command? through setti ng the mir register (0x4e) to ?1?, automatic transition from sleep to normal mode is possible. the conditions for a change in mode from sleep to normal to occur for both enabled and disabled ?automatic mode transition function? are shown below: conditions for sleep to normal mode transition when ?automatic mode transition function? is enabled: 1. normal mode transition command is sent 2. por occurs or reset command sent (initialization) 3. a switch status changes (the ?switch ch ange interrupt setting? should be enabled) conditions for sleep to normal mode transition when ?automatic mode transition function? is disabled: 1. normal mode transition command is sent 2. por occurs or reset command sent (initialization) monitor period strobe time current time curernt source on current source off curernt source on current source off datasheet d a t a s h e e t 22/72 tsz22111 ? 15 ? 001 ? 2016 rohm co., ltd. all rights reserved. www.rohm.com 19.jun.2017 rev.003 tsz02201-0e3e0hz00650-1-2 BD3375MUV-M [extension function1: intermittent monitoring at the same time (with current slope)] in intermittent monitoring, it is possible to detect the status of the all switches at the same time. when all inputs are set t o detect the switch status by intermittent monitoring , the wetting current has a rising and falling slope. normal mode setting register (0x4b) : 31 to 28 bit is ?0000? and intermittent monitoring setting sleep mode setting register (0x4c) : 31 to 28 bit is ?0000? and intermittent monitoring setting figure 14. intermittent monitoring at the same time example [extension function 2: sequential monitoring by power supply system] in this type of sequential monitoring, the status of the switches within a power s upply system is monitored one at a time. this type has no slope. since no two or more current sources in a power supply system are on at the same time, radiation noise is reduced. figure 15. sequential monitoring by power supply system example on off 5ms 10ms 2.5ms internal reference current source inz0-7 ina0-7 inb0-5 2.5ms strobe time [ s] monitor period h set to fitz=2.5ms, fita=5ms, fitb=10ms on off on off on off on off on off on off on off on off on off on off on off on off on off on off 10ms 5ms internal reference current source inz0 inz1 inz2 : _ inz7 strobe time x 8[ s] ina0 ina1 ina2 : _ ina7 inb0 inb1 inb2 : _ inb5 2.5ms monitor period h set to fitz=2.5ms, fita=5ms, fitb=10ms on on on on off off off off on on on on off off off off on on on on off off off off on on on on off off off off on on on on off off off off on on on on off off off off on on on on off off off off on on on on off off off off on on on on off off off off on on on on off off off off datasheet d a t a s h e e t 23/72 tsz22111 ? 15 ? 001 ? 2016 rohm co., ltd. all rights reserved. www.rohm.com 19.jun.2017 rev.003 tsz02201-0e3e0hz00650-1-2 BD3375MUV-M [extension function 3: sequential monitoring of all switch terminals] in this type of sequential monitoring, the status of all switches is monitored one at a time. since no two or more current sources are on at the same time, radiation noise is reduced. this type has no slope. the monitoring period for all switches increases by four time s the monitoring period set for the inz channels as shown in figure 16. uniform sequential monitoring and sequential monitori ng by power supply should not be enabled at the same time. in case the two sequential monitoring methods are activated si multaneously, the method which prevails is uniform sequential monitoring. figure 16. sequential monitoring of all switches terminals example fitz setting value x 4 internal reference current source inz0 inz1 inz2 : _ inz7 strobe time x 8[ s] ina0 ina1 ina2 : _ ina7 inb0 inb1 inb2 : _ inb5 monitor period h set to fitz=2.5ms, fita=5ms, fitb=10ms on on on on off off off off on on on on off off off off on on on on off off off off on on on on off off off off datasheet d a t a s h e e t 24/72 tsz22111 ? 15 ? 001 ? 2016 rohm co., ltd. all rights reserved. www.rohm.com 19.jun.2017 rev.003 tsz02201-0e3e0hz00650-1-2 BD3375MUV-M 7. wakeb terminal wakeb is an open drain output pin. in normal mode, its output is ?l?. in sleep mode, its output is ?hi-z? and its voltage level is the level of the external pull- up. 8. source/sink current source for switch terminal there are three types of switch terminal inputs with internal current source: inz, ina, and inb. the current level can be set for each switch terminal. current source of inz system (inz0 ? inz7) this current source is used to source or sink current to the external switch. the wetting current can be interchanged between pull-up and pull-down. vpua is the powe r supply for the pull-up current source. current source of ina (ina0 ? ina7) this current source is used to source current to the external switch. vpua is the power supply current source of inb (inb0 ? inb5) this current source is used to source current to the external switch. vpub is the power supply. the current source settings can be fixed by inz current s ource/sink selection command, the current source setting command, and the holding current/wetting current value setting command. datasheet d a t a s h e e t 25/72 tsz22111 ? 15 ? 001 ? 2016 rohm co., ltd. all rights reserved. www.rohm.com 19.jun.2017 rev.003 tsz02201-0e3e0hz00650-1-2 BD3375MUV-M 9. wetting current timer the wetting current timer is 13ms to 22ms. this function can be enabled individually for each switch terminal. the timer starts after the switch has been detected as on. after the 13ms to 22ms timer is finished, the wetting current (10ma/15ma) is switched to holding current (1 ma/3ma/5ma). the timer is reset a fter the switch is turned off. [function operation1] wetting current timer (continuous operation) figure 17. wetting current timer (continuous operation) q switch change occurs (off : on), ic detects switch status change. r when on state of the switch continues for more than 13ms to 22ms, the holding current is output. s switch change occurs (on : off). t switch change occurs (off : on), ic detects switch status change. u when on state of the switch continues for more than 13ms to 22ms, the holding current is output. intb interrupt occurs interrupt occurs interrupt occurs csb so external sw itch sw itch-off sw itch-on sw itch-off sw itch-on internal reference current source cur r ent sw itch terminal current d d!d" command command wetting current holding current wetting current holding curent d d# switch status output twct (13ms to 22ms) switch status output twct (13ms to 22ms) datasheet d a t a s h e e t 26/72 tsz22111 ? 15 ? 001 ? 2016 rohm co., ltd. all rights reserved. www.rohm.com 19.jun.2017 rev.003 tsz02201-0e3e0hz00650-1-2 BD3375MUV-M [function operation2] wetting current timer (intermittent monitoring) figure 18. wetting current timer (intermittent monitoring) q switch change occurs (off : on) r ic detects switch status change. s when on state of the switch continues for more than 13ms to 22ms, the holding current is output. t switch change occurs (on : off). u ic detects switch status change, switch current is switched from holding current to wetting current. v switch change occurs (off : on). w ic detects switch status change. x when on state of the switch continues for more than 13ms to 22ms, the holding current is output. intb interrupt occurs interrupt occurs interrupt occurs csb so external sw itch switch-on switch-off switch-on current status current sw itch terminal current d d"d$ co mman d comma nd wetting current holding current wetting current h olding curren t d d!d#d%d& switch status output ? ?>?? > >y>??? >? ?>>t>t?? switch status output ? ?>?? > >y>??? >? ?>>t>t?? datasheet d a t a s h e e t 27/72 tsz22111 ? 15 ? 001 ? 2016 rohm co., ltd. all rights reserved. www.rohm.com 19.jun.2017 rev.003 tsz02201-0e3e0hz00650-1-2 BD3375MUV-M 10. n-times matched filter all switch inputs have built-in ?1 to 6 ti mes matched filters?. this function can filt er the on/off switch status judgment made by the internal comparator. the filter function can be enabled for each power supply system. if the register has been updated during the counting of the filt er, the counting is not reset. if the monitoring method is continuous monitoring, the switch st ate is filtered n times (n: 1 to 6) multiplied by the period of the internal oscillator (32 khz). if the monitoring method is intermittent moni toring, the switch state is filtered n time s (n: 1 to 6) multiplied by the monitor ing period. time from monitoring to end of filtering: {monitoring period x (filter number of times -1) + period of internal oscillator} to {monitoring period x (filter number of times) + period of internal oscillator} figure 19. 3 times matched filter o peration on continuous monitoring time from monitoring to end of filtering: {monitoring period x (filter number of times -1) + period of internal oscillator} to {monitoring period x (filter number of times) + period of internal oscillator} figure 20. 3 times matched filter operation on intermittent monitoring g? set to full-time monitor : sampling period is internal oscillator period h 31.25 s (typ) 1st 2nd 3rd 1st 2nd 3rd reflected interrupt ? delay ? time off on off on on status ? tra ns ition filter ? matched 3 ? ti me s output internal osc sampling ? cl ock current s ource on/off external switch internal ? oscillator ? period ? on on off off on on on on on on offoffoffoffoffoff status ? tra ns ition filter ? matched 3 ? ti me s output internal osc sampling ? cl ock current s ource on/off external switch interrupt ? delay ? time datasheet d a t a s h e e t 28/72 tsz22111 ? 15 ? 001 ? 2016 rohm co., ltd. all rights reserved. www.rohm.com 19.jun.2017 rev.003 tsz02201-0e3e0hz00650-1-2 BD3375MUV-M 11. digital multiplexer output (dmux) the status of the selected sw itch input is reflected by the dmux terminal. dmux takes the output of the comparator on a timing determined by the monitoring method. only one switch terminal at a time can be selected to be reflected by dmux. when no switch is selected, the output of dmux is ?l?. 12. input threshold volt age of switch terminal the switch input threshold voltage is a fraction of the avdd voltage. it can be set to 3.0v or to 4.0v. 3.0v setting >8 v th3 =avddx0.6 ( 8.0v ? vpub ? 26v ) 4.0v setting >8 v th4 =avddx0.8 ( 8.0v ? vpub ? 26v ) table 16. relationship between the switch input threshold voltage and the so output input type source or sink input voltage co mparator output so serial interface bit inz source inz datasheet d a t a s h e e t 29/72 tsz22111 ? 15 ? 001 ? 2016 rohm co., ltd. all rights reserved. www.rohm.com 19.jun.2017 rev.003 tsz02201-0e3e0hz00650-1-2 BD3375MUV-M command description each command has two types of functions. one is to write a val ue to a register. the other is to read back the register value which was written by the write command. the function to be us ed is set by the 37-bit of each command. (the null and reset commands don?t include the register value output co mmand because they don?t write in the registers.) in the command descriptions below, the write command is for wr iting a value to a register and the read command is for reading back a register value. 1. null command this command is a read only command that allows t he user to monitor interruption and switch status. table 17. null command 2. interrupt notification of switch change setting command this command allows the user to configure interrupt sources for the intb pin. specifically, this command allows the user to individually co nfigure which switches trigger an interrupt on intb by enabling or disabling the iebn, iean, and iezn setting bits shown below. the so output will return the switch status depending on the settings st ored at the next csb falling edge. table 18. interrupt notification of switch change setting command iebn (n: 5-0) [default: 1] in terrupt notification of switch status change for inb system 0: disabled 1: enabled iean (n: 7-0) [default: 1] in terrupt notification of switch status change for ina system 0: disabled 1: enabled iezn (n: 7-0) [default: 1] in terrupt notification of switch status change for inz system 0: disabled 1: enabled w/r register write/read setting 0: write 1: read 3. comparator operat ion control command this command allows the user to individually enable or di sable the switch terminal comparator for each switch input. when a switch input?s comparator is disabled through this regist er, both the corresponding settings available for that switch input within the ?interrupt notification of switch cha nge setting command? and the ?source/sink current setting command? are invalid. when the comparator is active, the switch status output does not depend on whether the wetting current is set to source or sink. the switch status output is ?1? when the sw itch is on and ?0? when the switch is off. when the comparator is set to disabl ed, the switch status is undefined. table 19. comparator oper ation control command cmbn (n: 5-0) [default: 1] compar ator operation for inb system 0: disabled 1: enabled cman (n: 7-0) [default: 1] comparator operation for ina system 0: disabled 1: enabled cmzn (n: 7-0) [default: 1] comp arator operation for inz system 0: disabled 1: enable w/r register write/read setting 0: write 1: read crc x 39 38 37 7-0 31 26 25 27 30 36 35 34 33 32 x 29 28 24 18 17 23 22 21 20 0 null command (read only) 16 crc 11 10 9 15 14 irc 1 xxxxxx x 8 xx 12 xxxxx 13 19 x x xxxx command 0:?l?, 1:?h?, x: don't care setting data xx 0000 setting data 00 register address register address crc 30 setting data 29 28 27 1 31 25 33 32 setting data ieb4 26 19 18 command 0:?l?, 1:?h?, x: don't care 39 38 37 36 35 23 22 21 20 17 16 15 14 13 12 9 10 7-0 crc iez5 8 iea6 iea5 iea4 iea3 iea7 iez1 iea1 iea0 iez7 iea2 iez0 xx iez4 iez3 iez6 iez2 ieb5 11 ieb1 ieb0 ieb3 ieb2 24 interrupt notification of sw itch change setting ier 0 1 w/r 0 0 00 34 register address setting data crc 37 36 1 21 20 19 27 29 25 24 26 28 command 0:?l?, 1:?h?, x: don't care 39 38 34 33 32 35 23 30 7-0 9 crc cmb0 cmb1 11 10 12 17 cmz2 cmz1 cmz5 cmz4 cmz3 14 22 c ma7 c ma0 cma3 cma2 cma1 cmb2 cma6 cma5 cma4 cmb5 cmb4 13 15 setting data x 8 cmz0 w/r 0 0 comparator operation control cmr 0 1 cmz7 x 00 31 18 16 cmb3 cmz6 datasheet d a t a s h e e t 30/72 tsz22111 ? 15 ? 001 ? 2016 rohm co., ltd. all rights reserved. www.rohm.com 19.jun.2017 rev.003 tsz02201-0e3e0hz00650-1-2 BD3375MUV-M 4. comparator threshold selection command this command allows the user to set the comparator threshold of the switch terminals. switch detection threshold selection is available for each powe r supply system (see ctb, cta, ctz settings shown below). table 20. comparator threshold selection command ctb [default: 0] comparator threshold for inb system 0: 3.0v 1: 4.0v cta [default: 0] comparator threshold for ina system 0: 3.0v 1: 4.0v ctz [default: 0] comparator threshold for inz system 0: 3.0v 1: 4.0v w/r register write/read setting 0: write 1: read 5. inz current source/sink selection command this command allows the user to select the current configurat ion, whether source (internal pull-up current source) or sink (internal pull-down current source), th rough the inz input switch terminals. table 21. inz current source/sink selection command pudn (n: 7-0) [default: 0] source or sink selection for inz system 0: source (internal pull-up current source) 1: sink (internal pull-down current source) w/r register write/read setting 0: write 1: read 6. current source activation command this command allows the user to enable or disable the wetting current sources at the switch input terminals. the current sources can be set to on or off per power supply system. the output current level is determined by the ?holding cu rrent / wetting current value setting command? discussed in section 7 below. if an external current source is used, the comparator shoul d be enabled (see section 3 above) and the internal current source should be disabled using this register. table 22. current source activation command ceb [default: 0] current sources of inb system 0: off 1: on cea [default: 0] current sources of ina system 0: off 1: on cez [default: 0] current source of inz system 0: off 1: on w/r register write/read setting 0: write 1: read command 0:?l?, 1:?h?, x: don't care register address setting data 39 38 33 32 31 30 29 26 25 7-0 1w/r0 23 22 21 20 19 9 crc 37 36 x x ctz crc xxxxxx x 11 17 1 18 x 00 8 x 14 13 16 xxx xxxx 28 27 1ctb 12 10 x setting data 15 x comparator threshold selection ctr cta 0 x 24 35 34 register address setting data crc 34 0 w/r 0 0 1 37 xx 0 20 19 22 21 18 7-0 9 14 13 12 11 pud3 17 16 8 pud2 pud0 x pud1 x pud6 xx x xx 15 x x x x pud7 pud5 pud4 x 10 28 27 26 xx 23 39 38 36 setting data crc 35 31 30 29 inz current source/sink selection pudr 0 1 command 0:?l?, 1:?h?, x: don't care 33 25 24 32 current source activation cer 0 1 command 0:?l?, 1:?h?, x: don't care 29 register address xx ceb cez x xxxxx xxx crc crc x x x x 87-0 x x x x 1 11 10 9 cea x 39 38 36 33 24 27 26 25 30 20 22 21 28 32 31 34 37 19 18 0 12 16 15 14 13 17 x w/r 0 35 setting data 10 23 setting data datasheet d a t a s h e e t 31/72 tsz22111 ? 15 ? 001 ? 2016 rohm co., ltd. all rights reserved. www.rohm.com 19.jun.2017 rev.003 tsz02201-0e3e0hz00650-1-2 BD3375MUV-M 7. holding current / wetting current level selection command this command allows the user to select the output level of each current source. this command also has arguments to set both the holding and the wetting current. the holding current can be set to 1ma, 3ma, or 5ma. the wetting current can be set to off (?hi-z?), 1ma, 3m a, 5ma (set to holding current), 10ma, or 15ma. unlike holding current, wetting current output levels can be set individually for each switch terminal. table 23. holding current / wetting current level selection command (lsb) table 24. holding current / wetting current level selection command (msb) crh [1:0] [default: 00] holding current value 00: 1ma 01: 3ma 10: 5ma 11: 1ma {mcbn (n: 5-0), lcbn (n: 5-0)} [default: 01] wetting current value for inb system 00: invalid(hi-z) 01: 1/3/5m a(holding current value) 10: 10ma 11: 15ma {mcan (n: 7-0), lcan (n: 7-0)} [default: 01] wetting current value for ina system 00: invalid(hi-z) 01: 1/3/5m a(holding current value) 10: 10ma 11: 15ma {mczn (n: 7-0), lczn (n: 7-0)} [default: 01] wetting current value for inz system 00: invalid(hi-z) 01: 1/3/5m a(holding current value) 10: 10ma 11: 15ma w/r register write/read setting 0: write 1: read 8. wetting current operation control command this command allows the user to enable or disable the ?wetting current timer?. this ?wetting current timer? counts 13 to 22ms after the switch has been closed and the wetting current changes to holding current (1ma/3ma/5ma). the timer is reset when the switch is turned off. if the wetting current level is the same as the hol ding current level, the timer does not operate. the wetting current timer can be enabled or disabled individually for each switch terminal. table 25. wetting current operation control command wtbn (n: 5-0) [default: 0] wetting current timer for inb system 0: disabled 1: enabled wtan (n: 7-0) [default: 0] wetting current timer for ina system 0: disabled 1: enabled wtzn (n: 7-0) [default: 0] wetting current timer for inz system 0: disabled 1: enabled w/r register write/read setting 0: write 1: read crc setting data 01 39 38 w/r register address 0 1 lca3 0 13 lcz5 lcz6 23 22 21 28 27 26 12 11 10 15 24 crc lca1 lca0 16 32 lcb2 25 7-0 lca7 lcz2 29 lcz3 lcz1 lcb5 crh0 lcb3 14 crh1 lcz0 lcb1 lcb0 lcb4 lcz4 98 lca6 20 19 17 18 lcz7 lca5 lca4 lca2 holding current / wetting current level selection (lsb) lcr 0 1 35 36 30 37 33 command 0:?l?, 1:?h?, x: don't care 34 31 setting data 21 0 mc a7 mc a0 mc z7 mc z5 mc z4 mc z6 15 23 mc a4 mc a3 mc a2 9 crc mc z3 mc z2 mc z1 mc z0 mc a1 7-0 mc b3 mc b2 mc b1 mc b0 crc holding current / wetting current level selection (msb) mc r 0 1 w/r 0 command 0:?l?, 1:?h?, x: don't care register address setting data 39 38 37 36 35 25 24 18 1x 11 32 mc a6 mc a5 13 mc b5 setting data 14 34 17 16 1 8 22 1x 31 19 20 30 29 28 10 mc b4 27 26 12 33 crc 18 0 register address 10 wta2 wta1 setting data 0 wtb1 w/r 16 15 28 35 36 26 25 24 27 8 wtz2 wtz1 wtz0 wtz7 wtz6 wtz3 wta0 wtz5 x 22 21 20 19 32 31 37 11 10 14 13 command 0:?l?, 1:?h?, x: don't care 39 38 setting data 34 33 crc 7-0 12 xwtb5wtb4 30 29 wtb2 wtb3 17 0 wetting current operation control wtr 0 1 23 9 wtb0 wta7 wta6 wta5 wta4 wtz4 wta3 datasheet d a t a s h e e t 32/72 tsz22111 ? 15 ? 001 ? 2016 rohm co., ltd. all rights reserved. www.rohm.com 19.jun.2017 rev.003 tsz02201-0e3e0hz00650-1-2 BD3375MUV-M 9. n-times matched filter activation control command this command allows the user to enable or disable the n-times matched lpf. if this function is enabled, the switch ou tput is updated only after t he comparator output has been sampled ?n? times (where n = 1 to 10) and if all sampled comparator outputs match. this command allows for each switch terminal to be enabled or disabled individually. table 26. n-times matched filter activation control command dfb [2:0] [default: 000] n-times ma tched lpf settings for inb system 000 : disabled (1 time) 001 : 2 times 010 : 3 times 011 : 4 times 100 : 5 times 101 : 6 times 110 : disabled (1 time) 111 : disabled (1 time) dfa [2:0] [default: 000] n-times matched lpf settings for ina system 000 : disabled (1 time) 001 : 2 times 010 : 3 times 011 : 4 times 100 : 5 times 101 : 6 times 110 : disabled (1 time) 111 : disabled (1 time) dfz [2:0] [default: 000] n-times ma tched lpf settings for inz system 000 : disabled (1 time) 001 : 2 times 010 : 3 times 011 : 4 times 100 : 5 times 101 : 6 times 110 : disabled (1 time) 111 : disabled (1 time) w/r register write/read setting 0: write 1: read 17 22 21 19 18 001 34 register address x w/r crc crc xx x 7-0 14 13 12 11 10 9 8 dfa1 dfa0 x 16 15 32 31 setting data 30 26 28 27 39 38 37 36 35 29 33 24 setting data dfz1 dfz2 25 xxx x xxxx x dfz0 x dfb0 dfa2 dfb2 dfb1 20 23 1 0 n-tim es matched filter activation control dfr 0 1 command 0:?l?, 1:?h?, x: don't care datasheet d a t a s h e e t 33/72 tsz22111 ? 15 ? 001 ? 2016 rohm co., ltd. all rights reserved. www.rohm.com 19.jun.2017 rev.003 tsz02201-0e3e0hz00650-1-2 BD3375MUV-M 10. dmux setting command this command allows the user to enable/disable and conf igure selected switch output on the dmux terminal. the result of the chosen switch terminal?s comparator is taken and output to dmux using timing that depends on the monitoring method used. any switch input terminal can be connected to this dmux pin by adjusting the dmx0 to dmx4 bits shown below. table 27. dmux setting command table 28. dmux channel selection 31-27 bit selected channel 00000 disabled (output is ?l?) 00001 inz0 00010 inz1 00011 inz2 00100 inz3 00101 inz4 00110 inz5 00111 inz6 01000 inz7 01001 ina0 01010 ina1 01011 ina2 01100 ina3 01101 ina4 01110 ina5 01111 ina6 10000 ina7 10001 inb0 10010 inb1 10011 inb2 10100 inb3 10101 inb4 10110 inb5 10111-11111 disabled (output is ?l?) dmx [4:0] [default: 00000] dmux terminal setting 00000 : disabled (dmux output is ?l?) 00001 - 10110 : selected channel 10110 - 11111 : disabled (dmux output is ?l?) w/r register write/read setting 0: write 1: read command 0:?l?, 1:?h?, x: don't care dmux setting dmr 0 1 dmx4 dmx3 0 1 d mx2 d mx1 d mx0 x x x x xxxxxxx xxx xxxxx crc 7-0 15 29 39 38 setting data 30 23 22 21 8 9 14 13 18 17 16 12 11 20 19 10 w/r 24 27 26 25 33 28 32 31 register address 36 35 1 0 34 37 >??? ? ???>?? ? ? 0 crc datasheet d a t a s h e e t 34/72 tsz22111 ? 15 ? 001 ? 2016 rohm co., ltd. all rights reserved. www.rohm.com 19.jun.2017 rev.003 tsz02201-0e3e0hz00650-1-2 BD3375MUV-M 11. normal mode setting command this command allows the user to set the monitoring per iod, strobe time, and monitoring method of normal mode. the normal mode is set after power on reset or by ?monitor mode transition command?. the monitoring period can be set individually per power supply system but the strobe time is common to all switch terminals. the monitoring method can be set continuous monitoring, intermi ttent monitoring at the same time, sequential monitoring by power supply system and sequential monitoring of all switch terminals. continuous monitoring: ic monitors switch status continuously. refer to the ?[basic operation 1] dete ction of switch status change (contin uous monitoring)? section for additional details. intermittent monitoring at the same time: ic monitors switch status per power supply system at the same time. refer to the ?[extension function1: in termittent monitoring at the same time (with current slope)]? section for additional details. sequential monitoring by power supply system: ic monitors switch status per switch by turns on power supply system. refer to the ?[extension function 2: sequential monitoring by power supply system]? section for additional details. sequential monitoring of all switch terminals: ic monitors switch status per switch by turns. refer to the ?[extension function 3: sequential monitoring of all switch terminals]? section for additional details. if both sequential and continuous monitoring are enabled at the same time, continuous monitoring will be the one implemented. if both sequential monitoring by power supply system and sequent ial monitoring of all switch terminals are enabled at the same time, sequential monitoring of all switch terminals will be the one implemented. table 29. normal mode setting command fsq [default: 0] sequential monitoring of all switch terminals 0: disabled 1: enabled fsqb [default: 0] sequential monitoring by power supply system for inb system 0: disabled 1: enabled fsqa [default: 0] sequential monitoring by power supply system for ina system 0: disabled 1: enabled fsqz [default: 0] sequential monitoring by power supply system for inz system 0: disabled 1: enabled fit*[3:0] (*: b, a, z) [default: 0000] monitoring period for normal mode 0000: continuous monitoring 0001: 2.5ms 0010: 5ms 0011: 10ms 0100: 20ms 0101: 30ms 0110: 40ms 0111: 50ms 1000: 100ms 1001 ? 1111: setting prohibited svw [1:0] [default: 01] strobe time 00: 93.75s 01: 125s 10: 187.5s 11: 250s w/r register write/read setting 0: write 1: read 37 36 35 34 normal mode setting fmr 0 1 0 command 0:?l?, 1:?h?, x: don't care fsqb fitb3 fita3 fitz3 fitz2 14 svw0 fitz1 fitz0 x x x x crc fitb2 fitb1 x fsq x fita2 fitb0 39 38 setting data 25 30 29 28 20 19 18 17 16 fsqa fsqz 15 13 8 7-0 12 11 10 9 21 svw1 33 1 22 register address 1 23 32 fita1 fita0 setting data crc w/r 0 24 27 26 1 31 datasheet d a t a s h e e t 35/72 tsz22111 ? 15 ? 001 ? 2016 rohm co., ltd. all rights reserved. www.rohm.com 19.jun.2017 rev.003 tsz02201-0e3e0hz00650-1-2 BD3375MUV-M 12. sleep mode setting command this command allows the user to set the monitoring period and monitoring method of sleep mode. the sleep mode is set by ?monitor mode transition command?. the strobe time of sleep mode is the same as the normal mode. about the monitoring period and monitoring method, refer to the ?normal mode setting command? discussed in section 11 below. table 30. sleep mode setting command ssq [default: 0] sequential monitoring of all switch terminals 0: disabled 1: enabled ssqb [default: 0] sequential monitoring by power supply system for inb system 0: disabled 1: enabled ssqa [default: 0] sequential monitoring by power supply system for ina system 0: disabled 1: enabled ssqz [default: 0] sequential monitoring by power supply system for inz system 0: disabled 1: enable sit*[3:0] (*: b, a, z) [default: 0 111] monitoring period for sleep mode 0000: continuous monitoring 0001: 2.5ms 0010: 5ms 0011: 10ms 0100: 20ms 0101: 30ms 0110: 40ms 0111: 50ms 1000: 100ms 1001 ? 1111: setting prohibited w/r register write/read setting 0: write 1: read 36 30 29 28 sleep mode setting smr 0 1 37 xsitb3 23 sitb0 sitb2 sitb1 sita1 sita0 sitz2 sitz1 sitz0 x x x x sita3 sitz3 sita2 crc command 0:?l?, 1:?h?, x: don't care 39 38 setting data 27 34 33 32 31 26 ssq ssqb ssqa ssqz 22 21 20 19 18 17 16 15 xx 98 x 7-0 14 13 12 11 10 w/r 0 25 24 1 35 1 setting data 00 register address crc datasheet d a t a s h e e t 36/72 tsz22111 ? 15 ? 001 ? 2016 rohm co., ltd. all rights reserved. www.rohm.com 19.jun.2017 rev.003 tsz02201-0e3e0hz00650-1-2 BD3375MUV-M 13. detection edge selection command this command allows the user to configure inte rrupt trigger of switches for the intb pin. the interrupt trigger can be set to only the falling edge (note 22) or both the rising and falling edges of the switch input voltage per power supply system. if only the falling edge is selected, the intb pin not ch anges by the rising edges of switch input voltage. (note 22) if the inz current ?source setti ng? is enabled, the falling edge of the switch input terminal is seen when the extern al switch is turned on. if the inz current ?sink setting? is enabled, the falling edge is seen when the external switch is turned off. table 31. detection edge selection command isb [default: 1] switch edge where interrupt occurs for inb system 0: only falling edge 1: both edges isa [default: 1] switch edge where interrupt occurs for ina system 0: only falling edge 1: both edges isz [default: 1] switch edge where interrupt occurs for inz system 0: only falling edge 1: both edges w/r register write/read setting 0: write 1: read 14. automatic mode transition command this command allows the user to configure the mode to automatically change by a change in switch status. if the automatic transition is enabled, the monitoring period and monitoring method are changed to normal mode settings when it detects a change in switch status on sleep. refer to the ?[basic operation 4] sleep mode operation automatic transition to normal mode? section for additional details on how sleep mode operations works for this ic. table 32. automatic mode transition command mr_ier [default: 1] au tomatic mode transition 0: disabled 1: enabled w/r register write/read setting 0: write 1: read 15. monitor mode transition command this command allows the user to change the mode of operation between normal and sleep. refer to the ?[basic operation 3] sl eep mode operation (manual transition)? sect ion for additional details on how sleep mode operations works for this ic. table 33. monitor mode transition command mdc [default: 0] monitoring mode 0: normal mode 1: sleep mode w/r register write/read setting 0: write 1: read xxx crc xxxx 7-0 xxxxxxxxx 10 9 8 15 14 13 12 23 22 21 20 x setting data 18 17 16 11 36 crc iszxxx 01isb x detection edge selection isr 0 1 w/r 35 32 26 19 39 38 37 command 0:?l?, 1:?h?, x: don't care register address 34 33 setting data 25 24 27 28 011 31 30 29 isa automatic mode transition mir 0 1 command 0:?l?, 1:?h?, x: don't care x x 31 x xxxx xxx xxx xx setting data 30 29 23 22 21 28 27 26 32 39 x mr_ier 18 17 15 14 16 24 25 xxx 7-0 12 11 10 9 crc x 8 13 20 19 w/r 0 34 33 37 36 35 38 10 xxx setting data crc register address 11 monitor mode transition mdr 0 1 34 33 x xx xx md c x x 23 22 xxx x xx xx x x 16 crc command 0:?l?, 1:?h?, x: don't care 39 38 setting data 37 36 35 25 32 31 19 18 17 w/r 0 24 29 30 21 28 14 13 20 setting data 27 26 7-0 12 11 10 9 15 8 x xxx xx 1 register address 11 1 crc datasheet d a t a s h e e t 37/72 tsz22111 ? 15 ? 001 ? 2016 rohm co., ltd. all rights reserved. www.rohm.com 19.jun.2017 rev.003 tsz02201-0e3e0hz00650-1-2 BD3375MUV-M 16. reset command this command allows the user to reset the registers to thei r initial settings. after the reset command has been sent, the physical interrupt pin goes to low (intb=?l?). table 34. reset command 17. test command this command is used to enter test mode, which is only possible when the test pin is ?h?. table 35. test command 18. register map table 36. register map setting data crc 1 register address 11 11 0 98 xxxx x xx 18 17 16 15 7-0 14 13 12 11 10 23 30 29 28 34 33 22 21 20 19 26 25 27 command 0:?l?, 1:?h?, x: don't care 39 38 setting data 32 31 24 37 36 35 xxx crc x xxxxx xxxxx reset rst 0 1 x x x setting data crc register address 1001 1 37 36 7-0 35 23 30 29 28 39 38 22 21 20 18 34 33 32 25 24 31 26 27 setting data x 15 xx 13 12 xx 16 1 crc 11 10 9 8 xxx tss7 14 xxxxxx 19 17 tss1 tss0 xx tss5 tss4 tss3 tss2 tss6 test tsr 0 1 command 0:?l?, 1:?h?, x: don't care & 5 & 7 6 6 g h i 7 6 6 g h i 7 6 6 g h i 7 6 6 g h i 7 6 6 g h i 7 6 6 g h i & 5 & 7 ( 6 7 & r p p d q g > ' h i d x o w , q y d o l g @ 7 6 5 [ 7 6 6 g h i 7 6 6 g h i & 5 & 0 r q l w r u 0 r g h 7 w u d q v l w l r q & r p p d q g 5 h d g 5 0 ' 5 [ ) & 5 & $ x w r p d w l f 0 r g h 7 u d q v l w l r q & r p p d q g 5 h d g 5 0 , 5 [ ( & 5 & ' h w h f w l r q ( g j h 6 h o h f w l r q & r p p d q g 5 h d g 5 , 6 5 [ ' & 5 & 6 o h h s 0 r g h 6 h w w l q j & r p p d q g 5 h d g 5 6 0 5 [ & & 5 & 1 r u p d o 0 r g h 6 h w w l q j & r p p d q g 5 h d g 5 ) 0 5 [ % & 5 & ' 0 8 ; 6 h w w l q j & r p p d q g 5 h d g 5 ' 0 5 [ $ & 5 & q 7 l p h v 0 d w f k h g ) l o w h u $ f w l y d w l r q & r q w u r o & r p p d q g 5 h d g 5 ' ) 5 [ & 5 & : h w w l q j & x u u h q w 2 s h u d w l r q & r q w u r o & r p p d q g 5 h d g 5 : 7 5 [ & 5 & + r o g l q j & x u u h q w : h w w l q j & x u u h q w / h y h o 6 h o h f w l r q & r p p d q g 0 6 % 5 h d g 5 0 & 5 [ & 5 & + r o g l q j & x u u h q w : h w w l q j & x u u h q w / h y h o 6 h o h f w l r q & r p p d q g / 6 % 5 h d g 5 / & 5 [ & 5 & & x u u h q w 6 r x u f h $ f w l y d w l r q & r p p d q g 5 h d g 5 & ( 5 [ & 5 & , 1 = & x u u h q w 6 r x u f h 6 l q n 6 h o h f w l r q & r p p d q g 5 h d g 5 3 8 ' 5 [ & 5 & & r p s d u d w r u 7 k u h v k r o g 6 h o h f w l r q & r p p d q g 5 h d g 5 & 7 5 [ & 5 & & r p s d u d w r u 2 s h u d w l r q & r q w u r o & r p p d q g 5 h d g 5 & 0 5 [ & 5 & , q w h u u x s w 1 r w l i l f d w l r q r i 6 z l w f k & k d q j h 6 h w w l q j & r p p d q g 5 h d g 5 , ( 5 [ 5 h v h w & r p p d q g 5 6 7 [ ) & 5 & 0 r q l w r u 0 r g h 7 w u d q v l w l r q & r p p d q g > ' h i d x o w 1 r u p d o p r g h @ 0 ' 5 [ ) 0 ' & g h i & 5 & & 5 & $ x w r p d w l f 0 r g h 7 u d q v l w l r q & r p p d q g > ' h i d x o w $ x w r p d w l f w u d q v l w l r q l v y d o l g @ 0 , 5 [ ( 0 5 b , ( 5 g h i ' h w h f w l r q ( g j h 6 h o h f w l r q & r p p d q g > ' h i d x o w % r w k h g j h v @ , 6 5 [ ' , 6 % g h i , 6 $ g h i , 6 = g h i & 5 & 6 , 7 % g h i 6 , 7 $ g h i 6 , 7 = g h i 6 , 7 $ g h i 6 , 7 $ g h i 6 , 7 = g h i 6 , 7 = g h i 6 , 7 = g h i 6 6 4 $ g h i 6 6 4 = g h i 6 , 7 % g h i 6 , 7 % g h i 6 , 7 % g h i 6 , 7 $ g h i & 5 & 6 o h h s 0 r g h 6 h w w l q j & r p p d q g > ' h i d x o w 0 r q l w r u s h u l r g p v 6 h t x h q w l d o p r q l w r u l v l q y d o l g @ 6 0 5 [ & 6 6 4 g h i 6 6 4 % g h i ) , 7 % g h i ) , 7 $ g h i ) , 7 = g h i ) , 7 $ g h i ) , 7 = g h i ) , 7 = g h i ) , 7 = g h i 6 9 : g h i 6 9 : g h i ) 6 4 = g h i ) , 7 % g h i ) , 7 % g h i ) , 7 % g h i ) , 7 $ g h i ) , 7 $ g h i 1 r u p d o 0 r g h 6 h w w l q j & r p p d q g > ' h i d x o w ) x o o w l p h p r q l w r u 6 w u r e h w l p h x v 6 h t x h q w l d o p r q l w r u l v l q y d o l g @ ) 0 5 [ % ) 6 4 g h i ) 6 4 % g h i ) 6 4 $ g h i & 5 & ' 0 ; g h i ' 0 ; g h i ' 0 ; g h i & 5 & ' 0 8 ; 6 h w w l q j & r p p d q g > ' h i d x o w , q y d o l g @ ' 0 5 [ $ ' 0 ; g h i ' 0 ; g h i ' ) $ g h i ' ) $ g h i ' ) $ g h i ' ) = g h i ' ) = g h i ' ) = g h i q 7 l p h v 0 d w f k h g ) l o w h u $ f w l y d w l r q & r q w u r o & r p p d q g > ' h i d x o w , q y d o l g @ ' ) 5 [ ' ) % g h i ' ) % g h i ' ) % g h i : 7 = g h i : 7 = g h i : 7 = g h i : 7 = g h i & 5 & : 7 $ g h i : 7 $ g h i : 7 = g h i : 7 = g h i : 7 = g h i : 7 = g h i : 7 $ g h i : 7 $ g h i : 7 $ g h i : 7 $ g h i : 7 $ g h i : 7 $ g h i : 7 % g h i : 7 % g h i : 7 % g h i : 7 % g h i : 7 % g h i : 7 % g h i 0 & = g h i 0 & = g h i 0 & = g h i & 5 & : h w w l q j & x u u h q w 2 s h u d w l r q & r q w u r o & r p p d q g > ' h i d x o w , q y d o l g @ : 7 5 [ 0 & $ g h i 0 & = g h i 0 & = g h i 0 & = g h i 0 & = g h i 0 & = g h i 0 & $ g h i 0 & $ g h i 0 & $ g h i 0 & $ g h i 0 & $ g h i 0 & $ g h i 0 & % g h i 0 & % g h i 0 & % g h i 0 & % g h i 0 & % g h i 0 & $ g h i + r o g l q j & x u u h q w : h w w l q j & x u u h q w / h y h o 6 h o h f w l r q & r p p d q g 0 6 % > ' h i d x o w : h w w l q j f x u u h q w p $ + r o g l q j f x u u h q w @ 0 & 5 [ 0 & % g h i / & = g h i / & = g h i / & = g h i / & = g h i & 5 & / & $ g h i / & $ g h i / & = g h i / & = g h i / & = g h i / & = g h i / & $ g h i / & $ g h i / & $ g h i / & $ g h i / & $ g h i / & $ g h i / & % g h i / & % g h i / & % g h i / & % g h i / & % g h i / & % g h i & 5 & + r o g l q j & x u u h q w : h w w l q j & x u u h q w / h y h o 6 h o h f w l r q & r p p d q g / 6 % > ' h i d x o w : h w w l q j f x u u h q w p $ + r o g l q j f x u u h q w @ / & 5 [ & 5 + g h i & 5 + g h i & x u u h q w 6 r x u f h $ f w l y d w l r q & r p p d q g > ' h i d x o w 2 ) ) , q y d o l g @ & ( 5 [ & ( % g h i & ( $ g h i & ( = g h i 3 8 ' g h i 3 8 ' g h i 3 8 ' g h i 3 8 ' g h i & 5 & 3 8 ' g h i 3 8 ' g h i 3 8 ' g h i 3 8 ' g h i & 5 & , 1 = & x u u h q w 6 r x u f h 6 l q n 6 h o h f w l r q & r p p d q g > ' h i d x o w 6 r x u f h @ 3 8 ' 5 [ & r p s d u d w r u 7 k u h v k r o g 6 h o h f w l r q & r p p d q g > ' h i d x o w 9 @ & 7 5 [ & 7 % g h i & 7 $ g h i & 7 = g h i & 0 = g h i & 0 = g h i & 0 = g h i & 0 = g h i & 5 & & 0 $ g h i & 0 $ g h i & 0 = g h i & 0 = g h i & 0 = g h i & 0 = g h i & 0 $ g h i & 0 $ g h i & 0 $ g h i & 0 $ g h i & 0 $ g h i & 0 $ g h i & 0 % g h i & 0 % g h i & 0 % g h i & 0 % g h i & 0 % g h i & 0 % g h i , ( = g h i , ( = g h i , ( = g h i & 5 & & r p s d u d w r u 2 s h u d w l r q & r q w u r o & r p p d q g > ' h i d x o w 9 d o l g @ & 0 5 [ , ( $ g h i , ( = g h i , ( = g h i , ( = g h i , ( = g h i , ( = g h i , ( $ g h i , ( $ g h i , ( $ g h i , ( $ g h i , ( $ g h i , ( $ g h i , ( % g h i , ( % g h i , ( % g h i , ( % g h i , ( % g h i , ( $ g h i & 5 & , q w h u u x s w 1 r w l i l f d w l r q r i 6 z l w f k & k d q j h 6 h w w l q j & r p p d q g > ' h i d x o w 9 d o l g @ , ( 5 [ , ( % g h i 1 x o o & r p p d q g , 5 & [ 5 h j l v w h u 1 d p h 6 \ p e r o 5 h j l v w h u $ g g u h v v 6 h w w l q j ' d w d 1 d p h g h i ' h i d x o w 6 h w w l q j & 5 & datasheet d a t a s h e e t 38/72 tsz22111 ? 15 ? 001 ? 2016 rohm co., ltd. all rights reserved. www.rohm.com 19.jun.2017 rev.003 tsz02201-0e3e0hz00650-1-2 BD3375MUV-M table 37. register map (so bit alignment) register name symbol - read data name crc 24 23 22 21 39:32 31302928272625 2019181716151413121110 9 8 7:0 interrupt notification of switch change setting command read rier ?100?, interrupt factor 00 ieb5 (def:1) ieb4 (def:1) ieb3 (def:1) ieb2 (def:1) ieb1 (def:1) ieb0 (def:1) iea7 (def:1) iea6 (def:1) iea5 (def:1) iea4 (def:1) iea3 (def:1) iea2 (def:1) iea1 (def:1) iea0 (def:1) iez7 (def:1) iez6 (def:1) iez5 (def:1) iez4 (def:1) iez3 (def:1) iez2 (def:1) iez1 (def:1) iez0 (def:1) crc comparator operation control command read rcmr ?100?, interrupt factor 00 cmb5 (def:1) cmb4 (def:1) cmb3 (def:1) cmb2 (def:1) cmb1 (def:1) cmb0 (def:1) cma7 (def:1) cma6 (def:1) cma5 (def:1) cma4 (def:1) cma3 (def:1) cma2 (def:1) cma1 (def:1) cma0 (def:1) cmz7 (def:1) cmz6 (def:1) cmz5 (def:1) cmz4 (def:1) cmz3 (def:1) cmz2 (def:1) cmz1 (def:1) cmz0 (def:1) crc comparator threshold selection command read rctr ?100?, interrupt factor ctb (def:0) cta (def:0) ctz (def:0) 000000000000000000000crc inz current source/sink selection command read rpudr ?100?, interrupt factor 0000000000000000 pud7 (def:0) pud6 (def:0) pud5 (def:0) pud4 (def:0) pud3 (def:0) pud2 (def:0) pud1 (def:0) pud0 (def:0) crc : h w w l q j & x u u h q w 2 s h u d w l r q & r q w u r o & r p p d q g 5 h d g rcer ?100?, interrupt factor ceb (def:0) cea (def:0) cez (def:0) 000000000000000000000crc holding current / wetting current level selection command (lsb) read rlcr ?100?, interrupt factor crh1 (def:0) crh0 (def:0) lcb5 (def:1) lcb4 (def:1) lcb3 (def:1) lcb2 (def:1) lcb1 (def:1) lcb0 (def:1) lca7 (def:1) lca6 (def:1) lca5 (def:1) lca4 (def:1) lca3 (def:1) lca2 (def:1) lca1 (def:1) lca0 (def:1) lcz7 (def:1) lcz6 (def:1) lcz5 (def:1) lcz4 (def:1) lcz3 (def:1) lcz2 (def:1) lcz1 (def:1) lcz0 (def:1) crc holding current / wetting current level selection command (msb) read rmcr ?100?, interrupt factor 00 mc b5 (def:0) mc b4 (def:0) mc b3 (def:0) mc b2 (def:0) mc b1 (def:0) mc b0 (def:0) mca7 (def:0) mca6 (def:0) mca5 (def:0) mca4 (def:0) mca3 (def:0) mca2 (def:0) mca1 (def:0) mca0 (def:0) mcz7 (def:0) mcz6 (def:0) mc z5 (def:0) mc z4 (def:0) mc z3 (def:0) mc z2 (def:0) mc z1 (def:0) mc z0 (def:0) crc wetting current operation control command read rwtr ?100?, interrupt factor 00 wtb5 (def:0) wtb4 (def:0) wtb3 (def:0) wtb2 (def:0) wtb1 (def:0) wtb0 (def:0) wta7 (def:0) wta6 (def:0) wta5 (def:0) wta4 (def:0) wta3 (def:0) wta2 (def:0) wta1 (def:0) wta0 (def:0) wtz7 (def:0) wtz6 (def:0) wtz5 (def:0) wtz4 (def:0) wtz3 (def:0) wtz2 (def:0) wtz1 (def:0) wtz0 (def:0) crc n-times matched filter activation control command read rdfr ?100?, interrupt factor dfb2 (def:0) dfb1 (def:0) dfb0 (def:0) dfa2 (def:0) dfa1 (def:0) dfa0 (def:0) dfz2 (def:0) dfz1 (def:0) dfz0 (def:0) 000000000000000crc dmux setting command read rdmr ?100?, interrupt factor dmx4 (def:0) dmx3 (def:0) dmx2 (def:0) dmx1 (def:0) dmx0 (def:0) 0000000000000000000crc normal mode setting command read rfmr ?100?, interrupt factor fsq (def:0) fsqb (def:0) fsqa (def:0) fsqz (def:0) fitb2 (def:0) fitb1 (def:0) fitb0 (def:0) fita2 (def:0) fita1 (def:0) fita0 (def:0) fitz2 (def:0) fitz1 (def:0) fitz0 (def:0) svw1 (def:0) svw0 (def:1) fitb3 (def:0) fita3 (def:0) fitz3 (def:0) 000000crc sleep mode setting command read rsmr ?100?, interrupt factor ssq (def:0) ssqb (def:0) ssqa (def:0) ssqz (def:0) sitb2 (def:1) sitb1 (def:1) sitb0 (def:1) sita2 (def:1) sita1 (def:1) sita0 (def:1) sitz2 (def:1) sitz1 (def:1) sitz0 (def:1) 00 sitb3 (def:0) sita3 (def:0) sitz3 (def:0) 000000crc detection edge selection command read risr ?100?, interrupt factor isb (def:1) isa (def:1) isz (def:1) 000000000000000000000crc automatic mode transition command read rmir ?100?, interrupt factor mr_ ier (def:1) 00000000000000000000000crc monitor mode ttransition command read rmdr ?100?, interrupt factor md c (def:0) 000000000000000 00crc 000000 datasheet d a t a s h e e t 39/72 tsz22111 ? 15 ? 001 ? 2016 rohm co., ltd. all rights reserved. www.rohm.com 19.jun.2017 rev.003 tsz02201-0e3e0hz00650-1-2 BD3375MUV-M typical performance curves unless otherwise specified, vpua= vpub=13v, vddi=5v, lvdd=avdd=ref5 series products (BD3375MUV-M/bd 3375kv-c) use the same data. 0 50 100 150 200 250 300 350 400 450 500 -50 -25 0 25 50 75 100 125 150 vpua/vpub operating current: i vpux(off) [a] ambient temperature : ta[ ] vpub=26v vpub=13v vpub=8v 0 50 100 150 200 250 300 350 400 450 500 5 1015202530 vpua/vpub operating current: i vpux(off) [a] supply voltage : vpub[v] ta=125 b] ta= 25 b] ta= \ 40 b] 4 4.1 4.2 4.3 4.4 4.5 4.6 -50 -25 0 25 50 75 100 125 150 por deactivation voltage: v por(high) [v] ambient temperature : ta[ ] vpub=13v 3.9 4 4.1 4.2 4.3 4.4 4.5 -50 -25 0 25 50 75 100 125 150 por activation voltage: v por(low) [v] ambient temperature : ta[ ] vpub=13v figure 23. vpua/vpub operating current - temperature characteristic (continuous monitor setting, current source is invalid, ?hi-z? status) figure 22. por (power on reset) deactivation voltage -temperature characteristic figure 21. por (power on reset) activation voltage - temperature characteristic figure 24. vpua/vpub operating current - voltage characteristic (continuous monitor setting, current source is invalid, ?hi-z? status) datasheet d a t a s h e e t 40/72 tsz22111 ? 15 ? 001 ? 2016 rohm co., ltd. all rights reserved. www.rohm.com 19.jun.2017 rev.003 tsz02201-0e3e0hz00650-1-2 BD3375MUV-M typical performance curves - continued 0 10 20 30 40 50 60 70 80 90 100 -50 -25 0 25 50 75 100 125 150 vpua/vpub average operating current at intermittent monitoring: i vpux(ss) [a] ambient temperature : ta[ ] vpub=26v vpub=13v vpub=8v 0 10 20 30 40 50 60 70 80 90 100 5 1015202530 vpua/vpub average operating current at intermittent monitoring: i vpux(ss) [a] supply voltage : vpub[v] ta=125 b] ta=25 b] ta= \ 40 b] 0 1 2 3 4 5 6 7 8 9 10 3.0 3.5 4.0 4.5 5.0 5.5 vddi operating current: i vddi [a] supply voltage : vddi[v] ta=125 b] ta=25 b] ta= \ 40 b] 0 1 2 3 4 5 6 7 8 9 10 -50 -25 0 25 50 75 100 125 150 vddi operating current: i vddi [a] ambient temperature : ta[ ] vddi=5.25v vddi=5v vddi=3.1v figure 27. vddi operati ng current- temperature characteristic (intb=?h?, csb=?h?) figure 28. vddi operating current- voltage characteristic (intb=?h?, csb=?h?) figure 25. vpua/vpub average operating current at intermittent monitoring - temperature characteristic (monitoring period: 50ms, strobe time: 125s, source/sink current setting: 1ma) figure 26. vpua/vpub average operating current at intermittent monitoring - voltage characteristic (monitoring period: 50ms, strobe time: 125s, source/sink current setting: 1ma) datasheet d a t a s h e e t 41/72 tsz22111 ? 15 ? 001 ? 2016 rohm co., ltd. all rights reserved. www.rohm.com 19.jun.2017 rev.003 tsz02201-0e3e0hz00650-1-2 BD3375MUV-M typical performance curves - continued 4.75 4.80 4.85 4.90 4.95 5.00 5.05 5.10 5.15 5.20 5.25 -50 -25 0 25 50 75 100 125 150 ref5 output voltage: v ref5 [v] ambient temperature : ta[ ] vpub=26v vpub=13v vpub=8v 4.75 4.80 4.85 4.90 4.95 5.00 5.05 5.10 5.15 5.20 5.25 5 1015202530 ref5 output voltage: v ref5 [v] supply voltage : vpub[v] ta=125 b] ta=25 b] ta= \ 40 b] 1.0 1.1 1.2 1.3 1.4 1.5 1.6 1.7 1.8 -50 -25 0 25 50 75 100 125 150 source current 1 (1ma setting): i source1 [ma] ambient temperature : ta[ ] vpub=26v vpub=13v vpub=8v 1.0 1.1 1.2 1.3 1.4 1.5 1.6 1.7 1.8 0 5 10 15 20 25 30 source current 1 (1ma setting): i source1 [ma] supply voltage : vpub[v] ta=125 b] ta= \ 40 b] ta=25 b] figure 32. source current 1- voltage characteristic (1ma setting, 0v external supply) figure 31. source current 1- temperature characteristic (1ma setting, 0v external supply) figure 29. ref5 output voltage- temperature characteristic figure 30. ref5 output voltage- voltage characteristic datasheet d a t a s h e e t 42/72 tsz22111 ? 15 ? 001 ? 2016 rohm co., ltd. all rights reserved. www.rohm.com 19.jun.2017 rev.003 tsz02201-0e3e0hz00650-1-2 BD3375MUV-M typical performance curves - continued -1.0 -0.5 0.0 0.5 1.0 1.5 2.0 2.5 3.0 -50 -25 0 25 50 75 100 125 150 source current 1 (1ma setting): i source1 [ma] ambient temperature : ta[ ] vin=4v vin=8v vin=0v 1.0 1.1 1.2 1.3 1.4 1.5 1.6 1.7 1.8 4.7 4.8 4.9 5 5.1 5.2 5.3 sink current 1 (1ma setting): i sink1 [ma] supply voltage : avdd[v] ta= 125 b] ta= \ 40 b] ta=25 b] 1.0 1.1 1.2 1.3 1.4 1.5 1.6 1.7 1.8 -50 -25 0 25 50 75 100 125 150 sink current 1 (1ma setting): i sink1 [ma] ambient temperature : ta[ ] avdd=5v avdd=4.75v avdd=5.25 figure 36. sink current 1- voltage characteristic (1ma setting, 8v external supply) figure 34. source current 1- voltage characteristic (1ma setting) figure 33. source current 1- temperature characteristic (1ma setting) figure 35. sink current 1- temperature characteristic (1ma setting, 8v external supply) -1.0 -0.5 0.0 0.5 1.0 1.5 2.0 2.5 3.0 -20-10 0 1020304050 source current 1 (1ma setting): i source1 [ma] supply voltage : vin[v] ta=25 b] ta= \ 40 b] ta=125 b] datasheet d a t a s h e e t 43/72 tsz22111 ? 15 ? 001 ? 2016 rohm co., ltd. all rights reserved. www.rohm.com 19.jun.2017 rev.003 tsz02201-0e3e0hz00650-1-2 BD3375MUV-M typical performance curves - continued -1.0 -0.5 0.0 0.5 1.0 1.5 2.0 2.5 3.0 -50 -25 0 25 50 75 100 125 150 sink current 1 (1ma setting): i sink1 [ma] ambient temperature : ta[ ] vin=13v vin=8v vin=26v -1.0 -0.5 0.0 0.5 1.0 1.5 2.0 2.5 3.0 -20-100 1020304050 sink current 1 (1ma setting): i sink1 [ma] supply voltage : vin[v] ta=125 b] ta= \ 40 b] ta=25 b] 3.0 3.2 3.4 3.6 3.8 4.0 4.2 4.4 4.6 4.8 5.0 5.2 5.4 -50 -25 0 25 50 75 100 125 150 source current 2 (3ma setting): i source3 [ma] ambient temperature : ta[ ] vpub=8v vpub=13v vpub=26v 3.0 3.2 3.4 3.6 3.8 4.0 4.2 4.4 4.6 4.8 5.0 5.2 5.4 0 5 10 15 20 25 30 source current 2 (3ma setting): i source3 [ma] supply voltage : vpub[v] ta=125 b] ta= \ 40 b] ta=25 b] figure 37. sink current 1- temperature characteristic (1ma setting) figure 38. sink current 1- voltage characteristic (1ma setting) figure 39. source current 2- temperature characteristic (3ma setting, 0v external supply) figure 40. source current 2- voltage characteristic (3ma setting, 0v external supply) datasheet d a t a s h e e t 44/72 tsz22111 ? 15 ? 001 ? 2016 rohm co., ltd. all rights reserved. www.rohm.com 19.jun.2017 rev.003 tsz02201-0e3e0hz00650-1-2 BD3375MUV-M typical performance curves - continued -1.0 0.0 1.0 2.0 3.0 4.0 5.0 6.0 7.0 -50 -25 0 25 50 75 100 125 150 source current 2 (3ma setting): i source3 [ma] ambient temperature : ta[ ] vin=0v vin=8v vin=4v 3.0 3.2 3.4 3.6 3.8 4.0 4.2 4.4 4.6 4.8 5.0 5.2 5.4 -50 -25 0 25 50 75 100 125 150 sink current 2 (3ma setting): i sink3 [ma] ambient temperature : ta[ ] avdd=4.75v avdd=5v avdd=5.25v 3.0 3.2 3.4 3.6 3.8 4.0 4.2 4.4 4.6 4.8 5.0 5.2 5.4 4.7 4.8 4.9 5 5.1 5.2 5.3 sink current 2 (3ma setting): i sink3 [ma] supply voltage : avdd[v] ta=125 b] ta= \ 40 b] ta=25 b] figure 42. source current 2- voltage characteristic (3ma setting) figure 41. source current 2- temperature characteristic (3ma setting) figure 43. sink current 2- temperature characteristic (3ma setting, 8v external supply) figure 44. sink current 2- voltage characteristic (3ma setting, 8v external supply) -1.0 0.0 1.0 2.0 3.0 4.0 5.0 6.0 7.0 -20-10 0 1020304050 source current 2 (3ma setting): i source3 [ma] supply voltage : vin[v] ta=25 b] ta= \ 40 b] ta=125 b] datasheet d a t a s h e e t 45/72 tsz22111 ? 15 ? 001 ? 2016 rohm co., ltd. all rights reserved. www.rohm.com 19.jun.2017 rev.003 tsz02201-0e3e0hz00650-1-2 BD3375MUV-M typical performance curves - continued -1.0 0.0 1.0 2.0 3.0 4.0 5.0 6.0 7.0 -50 -25 0 25 50 75 100 125 150 sink current 2 (3ma setting): i sink3 [ma] ambient temperature : ta[ ] vin=13v vin=8v vin=26v -1.0 0.0 1.0 2.0 3.0 4.0 5.0 6.0 7.0 -20-10 0 1020304050 sink current 2 (3ma setting): i sink3 [ma] supply voltage : vin[v] ta=125 b] ta= \ 40 b] ta=25 b] 5.0 5.5 6.0 6.5 7.0 7.5 8.0 8.5 9.0 -50 -25 0 25 50 75 100 125 150 source current 3 (5ma setting): i source5 [ma] ambient temperature : ta[ ] vpub=13v vpub=26v vpub=8v 5.0 5.5 6.0 6.5 7.0 7.5 8.0 8.5 9.0 0 5 10 15 20 25 30 source current 3 (5ma setting): i source5 [ma] supply voltage : vpub[v] ta=125 b] ta= \ 40 b] ta=25 b] figure 48. source current 3- voltage characteristic (5ma setting, 0v external supply) figure 47. source current 3- temperature characteristic (5ma setting, 0v external supply) figure 45. sink current 2- temperature characteristic (3ma setting) figure 46. sink current 2- voltage characteristic (3ma setting) datasheet d a t a s h e e t 46/72 tsz22111 ? 15 ? 001 ? 2016 rohm co., ltd. all rights reserved. www.rohm.com 19.jun.2017 rev.003 tsz02201-0e3e0hz00650-1-2 BD3375MUV-M typical performance curves - continued 5.0 5.5 6.0 6.5 7.0 7.5 8.0 8.5 9.0 -50 -25 0 25 50 75 100 125 150 sink current 3 (5ma setting): i sink5 [ma] ambient temperature : ta[ ] avdd=5v avdd=5.25v avdd=4.75v 5.0 5.5 6.0 6.5 7.0 7.5 8.0 8.5 9.0 4.7 4.8 4.9 5 5.1 5.2 5.3 sink current 3 (5ma setting): i sink5 [ma] supply voltage : avdd[v] ta=125 b] ta= \ 40 b] ta=25 b] -1.0 0.0 1.0 2.0 3.0 4.0 5.0 6.0 7.0 8.0 9.0 10.0 -50 -25 0 25 50 75 100 125 150 source current 3 (5ma setting): i source5 [ma] ambient temperature : ta[ ] vin=4v vin=0v vin=8v figure 52. sink current 3- voltage characteristic (5ma setting, 8v external supply) figure 50. source current 3- voltage characteristic (5ma setting) figure 51. sink current 3- temperature characteristic (5ma setting, 8v external supply) figure 49. source current 3- temperature characteristic (5ma setting) -1.0 0.0 1.0 2.0 3.0 4.0 5.0 6.0 7.0 8.0 9.0 10.0 -20-10 0 1020304050 source current 3 (5ma setting): i source5 [ma] supply voltage : vin[v] ta=25 b] ta= \ 40 b] ta=125 b] datasheet d a t a s h e e t 47/72 tsz22111 ? 15 ? 001 ? 2016 rohm co., ltd. all rights reserved. www.rohm.com 19.jun.2017 rev.003 tsz02201-0e3e0hz00650-1-2 BD3375MUV-M typical performance curves - continued -1.0 0.0 1.0 2.0 3.0 4.0 5.0 6.0 7.0 8.0 9.0 10.0 -50 -25 0 25 50 75 100 125 150 sink current 3 (5ma setting): i sink5 [ma] ambient temperature : ta[ ] vin=13v vin=8v vin=26v -1.0 0.0 1.0 2.0 3.0 4.0 5.0 6.0 7.0 8.0 9.0 10.0 -20-100 1020304050 sink current 3 (5ma setting): i sink5 [ma] supply voltage : vin[v] ta=125 b] ta= \ 40 b] ta=25 b] 10 11 12 13 14 15 16 17 18 -50 -25 0 25 50 75 100 125 150 source current 4 (10ma setting): i source10 [ma] ambient temperature : ta[ ] vpub=8v vpub=26v vpub=13v 10 11 12 13 14 15 16 17 18 0 5 10 15 20 25 30 source current 4 (10ma setting): i source10 [ma] supply voltage : vpub[v] ta=25 b] ta= \ 40 b] ta=125 b] figure 54. sink current 3- voltage characteristic (5ma setting) figure 53. sink current 3- temperature characteristic (5ma setting) figure 56. source current 4- voltage characteristic (10ma setting, 0v external supply) figure 55. source current 4- temperature characteristic (10ma setting, 0v external supply) datasheet d a t a s h e e t 48/72 tsz22111 ? 15 ? 001 ? 2016 rohm co., ltd. all rights reserved. www.rohm.com 19.jun.2017 rev.003 tsz02201-0e3e0hz00650-1-2 BD3375MUV-M typical performance curves - continued -2 0 2 4 6 8 10 12 14 16 18 20 -50 -25 0 25 50 75 100 125 150 source current 4 (10ma setting): i source10 [ma] ambient temperature : ta[ ] vin=0v vin=8v vin =4v 10 11 12 13 14 15 16 17 18 -50 -25 0 25 50 75 100 125 150 sink current 4 (10ma setting): i sink10 [ma] ambient temperature : ta[ ] avdd=5v avdd=4.75v avdd=5.25v 10 11 12 13 14 15 16 17 18 4.7 4.8 4.9 5 5.1 5.2 5.3 sink current 4 (10ma setting): i sink10 [ma] supply voltage : avdd[v] ta=25 b] ta= \ 40 b] ta=125 b] figure 58. source current 4- voltage characteristic (10ma setting) figure 57. source current 4- temperature characteristic (10ma setting) figure 59. sink current 4- temperature characteristic (10ma setting, 8v external supply) figure 60. sink current 4- voltage characteristic (10ma setting, 8v external supply) -2 0 2 4 6 8 10 12 14 16 18 20 -20-10 0 1020304050 source current 4 (10ma setting): i source10 [ma] supply voltage : vin[v] ta=25 b] ta= \ 40 b] ta=125 b] datasheet d a t a s h e e t 49/72 tsz22111 ? 15 ? 001 ? 2016 rohm co., ltd. all rights reserved. www.rohm.com 19.jun.2017 rev.003 tsz02201-0e3e0hz00650-1-2 BD3375MUV-M typical performance curves - continued -2 0 2 4 6 8 10 12 14 16 18 20 -50 -25 0 25 50 75 100 125 150 sink current 4 (10ma setting): i sink10 [ma] ambient temperature : ta[ ] vin=8v vin=26v vin=13v -2 0 2 4 6 8 10 12 14 16 18 20 -20-10 0 1020304050 sink current 4 (10ma setting): i sink10 [ma] supply voltage : vin[v] ta=25 b] ta= \ 40 b] ta=125 b] 15 17 19 21 23 25 27 -50 -25 0 25 50 75 100 125 150 source current 5 (15ma setting): i source15 [ma] ambient temperature : ta[ ] vpub=26v vpub=13v vpub=8v 15 17 19 21 23 25 27 0 5 10 15 20 25 30 source current 5 (15ma setting): i source15 [ma] supply voltage : vpub[v] ta=25 b] ta= \ 40 b] ta=125 b] figure 61. sink current 4- temperature characteristic (10ma setting) figure 62. sink current 4- voltage characteristic (10ma setting) figure 64. source current 5- voltage characteristic (15ma setting, 0v external supply) figure 63. source current 5- temperature characteristic (15ma setting, 0v external supply) datasheet d a t a s h e e t 50/72 tsz22111 ? 15 ? 001 ? 2016 rohm co., ltd. all rights reserved. www.rohm.com 19.jun.2017 rev.003 tsz02201-0e3e0hz00650-1-2 BD3375MUV-M typical performance curves - continued -5 0 5 10 15 20 25 30 -50 -25 0 25 50 75 100 125 150 source current 5 (15ma setting): i source15 [ma] ambient ? temperature ? : ? ta[ b]? vin=0v vin=8v vin=4v 15 17 19 21 23 25 27 -50 -25 0 25 50 75 100 125 150 sink current 5 (15ma setting): i sink15 [ma] ambient temperature : ta[ ] avdd=5.25v avdd=5v avdd=4.75v 15 17 19 21 23 25 27 4.7 4.8 4.9 5 5.1 5.2 5.3 sink current 5 (15ma setting): i sink15 [ma] supply voltage : avdd[v] ta=125 b] ta=25 b] ta= \ 40 b] figure 65. source current 5- temperature characteristic (15ma setting) figure 66. source current 5- voltage characteristic (15ma setting) figure 67. sink current 5- temperature characteristic (15ma setting, 8v external supply) figure 68. sink current 5- voltage characteristic (15ma setting, 8v external supply) -5 0 5 10 15 20 25 30 -20-10 0 1020304050 source current 5 (15ma setting): i source15 [ma] supply voltage : vin[v] ta=25 b] ta= \ 40 b] ta=125 b] datasheet d a t a s h e e t 51/72 tsz22111 ? 15 ? 001 ? 2016 rohm co., ltd. all rights reserved. www.rohm.com 19.jun.2017 rev.003 tsz02201-0e3e0hz00650-1-2 BD3375MUV-M typical performance curves - continued 2.7 2.8 2.9 3.0 3.1 3.2 3.3 -50 -25 0 25 50 75 100 125 150 low to high switch detection threshold voltage (3.0v setting): v th3(high) [v] ambient temperature : ta[ ] vpub=26v vpub=8v vpub=13v 2.7 2.8 2.9 3.0 3.1 3.2 3.3 5 1015202530 low to high switch detection threshold voltage (3.0v setting): v th3(high) [v] supply voltage : vpub[v] ta=25 b] ta= \ 40 b] ta=125 b] -5 0 5 10 15 20 25 30 -50 -25 0 25 50 75 100 125 150 sink current 5 (15ma setting): i sink15 [ma] ambient temperature : ta[ ] vin= 26v vin=13v vin=8v -5 0 5 10 15 20 25 30 -20-10 0 1020304050 sink current 5 (15ma setting): i sink15 [ma] supply voltage : vin[v] ta=25 b] ta= \ 40 b] ta=125 b] figure 69. sink current 5- temperature characteristic (15ma setting) figure 70. sink current 5- voltage characteristic (15ma setting) figure 72. low to high switch detection threshold voltage - voltage characteristic (3.0v setting) figure 71. low to high switch detection threshold voltage - temperature characteristic (3.0v setting) datasheet d a t a s h e e t 52/72 tsz22111 ? 15 ? 001 ? 2016 rohm co., ltd. all rights reserved. www.rohm.com 19.jun.2017 rev.003 tsz02201-0e3e0hz00650-1-2 BD3375MUV-M typical performance curves - continued 2.6 2.7 2.8 2.9 3.0 3.1 3.2 -50 -25 0 25 50 75 100 125 150 high to low switch detection threshold voltage (3.0v setting): v th3(low) [v] ambient temperature : ta[ ] vpub=26v vpub=8v vpub=13v 2.6 2.7 2.8 2.9 3.0 3.1 3.2 5 1015202530 high to low switch detection threshold voltage (3.0v setting): v th3(low) [v] supply voltage : vpub[v] ta=25 b] ta= \ 40 b] ta=125 b] 3.7 3.8 3.9 4.0 4.1 4.2 4.3 -50 -25 0 25 50 75 100 125 150 low to high switch detection threshold voltage (4.0v setting): v th4(high) [v] ambient temperature : ta[ ] vpub=26v vpub=8v vpub=13v 3.7 3.8 3.9 4.0 4.1 4.2 4.3 5 1015202530 low to high switch detection threshold voltage (4.0v setting): v th4(high) [v] supply voltage : vpub[v] ta=25 b] ta= \ 40 b] ta=125 b] figure 73. high to low switch detection threshold voltage - temperature characteristic (3.0v setting) figure 74. high to low switch detection threshold voltage - voltage characteristic (3.0v setting) figure 76. low to high switch detection threshold voltage - voltage characteristic (4.0v setting) figure 75. low to high switch detection threshold voltage - temperature characteristic (4.0v setting) datasheet d a t a s h e e t 53/72 tsz22111 ? 15 ? 001 ? 2016 rohm co., ltd. all rights reserved. www.rohm.com 19.jun.2017 rev.003 tsz02201-0e3e0hz00650-1-2 BD3375MUV-M typical performance curves - continued 3.6 3.7 3.8 3.9 4.0 4.1 4.2 -50 -25 0 25 50 75 100 125 150 high to low switch detection threshold voltage (4.0v setting): v th4(hlow) [v] ambient temperature : ta[ ] vpub=26v vpub=8v vpub=13v 3.6 3.7 3.8 3.9 4.0 4.1 4.2 5 1015202530 high to low switch detection threshold voltage (4.0v setting): v th4(low) [v] supply voltage : vpub[v] ta=25 b] ta= \ 40 b] ta=125 b] 0.8 1.0 1.2 1.4 1.6 1.8 2.0 2.2 -50 -25 0 25 50 75 100 125 150 low to high serial interface threshold voltage : v inlogic [v] ambient temperature : ta[ ] vddi=5.25v vddi=3.1v vddi=5v 0.8 1.0 1.2 1.4 1.6 1.8 2.0 2.2 33.544.555.5 low to high serial interface threshold voltage : v inlogic [v] supply voltage : vddi[v] ta=25 b] ta= \ 40 b] ta=125 b] figure 77. high to low switch detection threshold voltage - temperature characteristic (4.0v setting) figure 78. high to low switch detection threshold voltage - voltage characteristic (4.0v setting) figure 79. low to high serial interface threshold voltage - temperature characteristic figure 80. low to high serial interface threshold voltage - voltage characteristic datasheet d a t a s h e e t 54/72 tsz22111 ? 15 ? 001 ? 2016 rohm co., ltd. all rights reserved. www.rohm.com 19.jun.2017 rev.003 tsz02201-0e3e0hz00650-1-2 BD3375MUV-M typical performance curves - continued -10 -8 -6 -4 -2 0 2 4 6 8 10 -50 -25 0 25 50 75 100 125 150 csb input current: i cs(high) [a] ambient temperature : ta[ ] vddi=3.1v vddi=5v vddi=5.25v -10 -8 -6 -4 -2 0 2 4 6 8 10 3.03.54.04.55.05.5 csb input current: i cs(high) [a] supply voltage : vddi[v] ta= \ 40 b] ta=25 b] ta=125 b] 30 35 40 45 50 55 60 65 70 75 80 85 -50 -25 0 25 50 75 100 125 150 csb pull-up current: i cs(low) [a] ambient temperature : ta[ ] vddi=3.1v vddi=5v vddi=5.25v 30 35 40 45 50 55 60 65 70 75 80 85 3.0 3.5 4.0 4.5 5.0 5.5 csb pull-up current: i cs(low) [a] supply voltage : vddi[v] ta=125 b] ta= \ 40 b] ta=25 b] figure 81. csb input current- temperature characteristic (csb=vddi) figure 82. csb input current- voltage characteristic (csb=vddi) figure 84. csb pull-up current- voltage characteristic (csb=0v) figure 83. csb pull-up current- temperature characteristic (csb=0v) datasheet d a t a s h e e t 55/72 tsz22111 ? 15 ? 001 ? 2016 rohm co., ltd. all rights reserved. www.rohm.com 19.jun.2017 rev.003 tsz02201-0e3e0hz00650-1-2 BD3375MUV-M typical performance curves - continued 50 60 70 80 90 100 110 120 130 140 150 -50 -25 0 25 50 75 100 125 150 si, sclk pull-down resistor: r si , r sclk [k ] ambient temperature : ta[ ] vddi=3.1v vddi=5v vddi=5.25v 50 60 70 80 90 100 110 120 130 140 150 3.03.54.04.55.05.5 si, sclk pull-down resistor: r si , r sclk [k ] supply voltage : vddi [v] ta=25 b] ta=-40 b] ta=125 b] -10 -8 -6 -4 -2 0 2 4 6 8 10 -50 -25 0 25 50 75 100 125 150 si, sclk input current: i si(low) , i sclk(low) [ a] ambient temperature : ta[ ] vddi=3.1v vddi=5v vddi=5.25v -10 -8 -6 -4 -2 0 2 4 6 8 10 3.0 3.5 4.0 4.5 5.0 5.5 si, sclk input current: i si(low) , i sclk(low) [ a] supply voltage : vddi[v] ta=125 b] ta=25 b] ta= \ 40 b] figure 85. si, sclk pull-down resistor- temperature characteristic figure 86. si, sclk pull-down resistor- voltage characteristic figure 87. si, sclk input current- temperature characteristic (si, sclk=0v) figure 88. si, sclk input current- voltage characteristic (si, sclk=0v) datasheet d a t a s h e e t 56/72 tsz22111 ? 15 ? 001 ? 2016 rohm co., ltd. all rights reserved. www.rohm.com 19.jun.2017 rev.003 tsz02201-0e3e0hz00650-1-2 BD3375MUV-M typical performance curves - continued 0 1 2 3 4 5 6 7 -50 -25 0 25 50 75 100 125 150 so ?h? level output voltage: v so(high) [v] ambient temperature : ta[ ] vddi=3.1v vddi=5v vddi=5.25v 0 1 2 3 4 5 6 7 3.03.54.04.55.05.5 so ?h? level output voltage: v so(high) [v] supply voltage : vddi[v] ta=125 b] ta= \ 40 b] ta=25 b] 0 50 100 150 200 250 300 350 400 -50 -25 0 25 50 75 100 125 150 so ?l? level output voltage: v so(low) [mv] ambient temperature : ta[ ] vddi=5v vddi=5.25v vddi=3.1v 0 50 100 150 200 250 300 350 400 3.0 3.5 4.0 4.5 5.0 5.5 so ?l? level output voltage: v so(low) [mv] supply voltage : vddi[v] ta= \ 40 b] ta=125 b] ta=25 b] figure 89. so ?h? level output voltage- temperature characteristic (i source =200a) figure 90. so ?h? level output voltage- voltage characteristic (i source =200a) figure 92. so ?l? level output voltage- voltage characteristic (i sink =1.6ma) figure 91. so ?l? level ou tput voltage- temperature characteristic (i sink =1.6ma) datasheet d a t a s h e e t 57/72 tsz22111 ? 15 ? 001 ? 2016 rohm co., ltd. all rights reserved. www.rohm.com 19.jun.2017 rev.003 tsz02201-0e3e0hz00650-1-2 BD3375MUV-M typical performance curves - continued -10 -8 -6 -4 -2 0 2 4 6 8 10 -50 -25 0 25 50 75 100 125 150 so (set to ?hi-z?) input current: i so(tri) [ma] ambient temperature : ta[ ] vddi=3.1v vddi=5v vddi=5.25v -10 -8 -6 -4 -2 0 2 4 6 8 10 3.0 3.5 4.0 4.5 5.0 5.5 so (set to ?hi-z?) input current: i so(tri) [ma] supply voltage : vddi[v] ta=125 b] ta=25 b] ta= \ 40 b] 0 1 2 3 4 5 6 7 -50 -25 0 25 50 75 100 125 150 dmux ?h? level output voltage: v dmux(high) [v] ambient temperature : ta[ ] vddi=5v vddi=5.25v vddi=3.1v 0 1 2 3 4 5 6 7 3.0 3.5 4.0 4.5 5.0 5.5 dmux ?h? level output voltage: v dmux(high) [v] supply voltage : vddi[v] ta=25 b] ta= \ 40 b] ta=125 b] figure 95. dmux ?h? level ou tput voltage- temperature characteristic (i source =200a) figure 96. dmux ?h? level output voltage- voltage characteristic (i source =200a) figure 93. so (set to ?hi-z ?) input current- temperature characteristic figure 94. so (set to ?hi-z?) input current- voltage characteristic datasheet d a t a s h e e t 58/72 tsz22111 ? 15 ? 001 ? 2016 rohm co., ltd. all rights reserved. www.rohm.com 19.jun.2017 rev.003 tsz02201-0e3e0hz00650-1-2 BD3375MUV-M typical performance curves - continued 0 50 100 150 200 250 300 350 400 -50 -25 0 25 50 75 100 125 150 dmux ?l? level output voltage: v dmux(low) [mv] ambient temperature : ta[ ] vddi=5v vddi=5.25v vddi=3.1v 0 50 100 150 200 250 300 350 400 3.0 3.5 4.0 4.5 5.0 5.5 dmux ?l? level output voltage: v dmux(low) [mv] supply voltage : vddi[v] ta=25 b] ta= \ 40 b] ta=125 b] 15 20 25 30 35 40 45 50 55 60 65 70 75 80 85 3.03.54.04.55.05.5 intb internal pull-up current: i intb(pu) [a] supply voltage : vddi[v] ta=125 b] ta= \ 40 b] ta=25 b] 15 20 25 30 35 40 45 50 55 60 65 70 75 80 85 -50 -25 0 25 50 75 100 125 150 intb internal pull-up current: i intb(pu) [a] ambient temperature : ta[ ] vddi=5v vddi=5.25v vddi=3.1v figure 97. dmux ?l? level ou tput voltage- temperature characteristic (i sink =1.6ma) figure 98. dmux ?l? level output voltage- voltage characteristic (i sink =1.6ma) figure 100. intb internal pull-up current- voltage characteristic figure 99. intb internal pull-up current- temperature characteristic datasheet d a t a s h e e t 59/72 tsz22111 ? 15 ? 001 ? 2016 rohm co., ltd. all rights reserved. www.rohm.com 19.jun.2017 rev.003 tsz02201-0e3e0hz00650-1-2 BD3375MUV-M typical performance curves - continued 0 1 2 3 4 5 6 7 -50 -25 0 25 50 75 100 125 150 intb ?h? level output voltage: v intb(high) [v] ambient temperature : ta[ ] vddi=5v vddi=5.25v vddi=3.1v 0 1 2 3 4 5 6 7 3.0 3.5 4.0 4.5 5.0 5.5 intb ?h? level output voltage: v intb(high) [v] supply voltage : vddi[v] ta=125 b] ta= \ 40 b] ta=25 b] 0 50 100 150 200 250 300 350 400 -50 -25 0 25 50 75 100 125 150 intb ?l? level output voltage: v intb(low) [mv] ambient temperature : ta[ ] avdd=5v avdd=5.25v avdd=4.75v 0 50 100 150 200 250 300 350 400 4.7 4.8 4.9 5.0 5.1 5.2 5.3 intb ?l? level output voltage: v intb(low) [mv] supply voltage : avdd[v] ta=125 b] ta= \ 40 b] ta=25 b] figure 101. intb ?h? level ou tput voltage- temperature characteristic (intb=open) figure 102. intb ?h? level output voltage- voltage characteristic (intb=open) figure 104. intb ?l? level output voltage- voltage characteristic (i sink =1.0ma) figure 103. intb ?l? level ou tput voltage- temperature characteristic (i sink =1.0ma) datasheet d a t a s h e e t 60/72 tsz22111 ? 15 ? 001 ? 2016 rohm co., ltd. all rights reserved. www.rohm.com 19.jun.2017 rev.003 tsz02201-0e3e0hz00650-1-2 BD3375MUV-M typical performance curves - continued 0 50 100 150 200 250 300 350 400 -50 -25 0 25 50 75 100 125 150 wakeb ?l? level output voltage: v wakeb(low) [mv] ambient temperature : ta[ ] avdd=5v avdd=5.25v avdd=4.75v 0 50 100 150 200 250 300 350 400 4.7 4.8 4.9 5.0 5.1 5.2 5.3 wakeb ?l? level output voltage: v wakeb(low) [mv] supply voltage : avdd[v] ta=125 b] ta= \ 40 b] ta=25 b] -10 -8 -6 -4 -2 0 2 4 6 8 10 -50 -25 0 25 50 75 100 125 150 wakeb (set to ?hi-z?) input current: i wakeb(tri) [ a] ambient temperature : ta[ ] vpub=8v vpub=13v vpub=26v -10 -8 -6 -4 -2 0 2 4 6 8 10 5.0 10.0 15.0 20.0 25.0 30.0 wakeb (set to ?hi-z?) input current: i wakeb(tri) [ a] supply voltage : vpub[v] ta=125 b] ta=25 b] ta= \ 40 b] figure 106. wakeb ?l? level output voltage- voltage characteristic (wakeb=1.0ma) figure 105. wakeb ?l? level ou tput voltage- temperature characteristic (wakeb=1.0ma) figure 107. wakeb (set to ?hi- z?) input current- temperature characteristic figure 108. wakeb (set to ? hi-z?) input current- voltage characteristic datasheet d a t a s h e e t 61/72 tsz22111 ? 15 ? 001 ? 2016 rohm co., ltd. all rights reserved. www.rohm.com 19.jun.2017 rev.003 tsz02201-0e3e0hz00650-1-2 BD3375MUV-M typical performance curves - continued 80 85 90 95 100 105 110 -50 -25 0 25 50 75 100 125 150 switch strobe time(93.75s setting): t scan_94 [s] ambient temperature : ta[ ] l/avdd=5v l/avdd=5.25v l/avdd=4.75 80 85 90 95 100 105 110 4.7 4.8 4.9 5.0 5.1 5.2 5.3 switch strobe time(93.75s setting): t scan_94 [s] supply voltage : l/avdd[v] ta=125 b] ta= \ 40 b] ta=25 b] 110 115 120 125 130 135 140 -50 -25 0 25 50 75 100 125 150 switch strobe time(125s setting): t scan_125 [s] ambient temperature : ta[ ] l/avdd=5v l/avdd=5.25v l/avdd=4.75v 110 115 120 125 130 135 140 4.7 4.8 4.9 5.0 5.1 5.2 5.3 switch strobe time(125s setting): t scan_125 [s] supply voltage : l/avdd[v] ta=125 b] ta= \ 40 b] ta=25 b] figure 110. switch strobe time- voltage characteristic (93.75s setting) figure 109. switch strobe time - temperature characteristic (93.75s setting) figure 111. switch strobe time - temperature characteristic (125s setting) figure 112. switch strobe time- voltage characteristic (125s setting) datasheet d a t a s h e e t 62/72 tsz22111 ? 15 ? 001 ? 2016 rohm co., ltd. all rights reserved. www.rohm.com 19.jun.2017 rev.003 tsz02201-0e3e0hz00650-1-2 BD3375MUV-M typical performance curves - continued 160 165 170 175 180 185 190 195 200 205 210 -50 -25 0 25 50 75 100 125 150 switch strobe time(187.5s setting): t scan_188 [s] ambient temperature : ta[ ] l/avdd=5v l/avdd=5.25v l/avdd=4.75v 160 165 170 175 180 185 190 195 200 205 210 4.7 4.8 4.9 5.0 5.1 5.2 5.3 switch strobe time(187.5s setting): t scan_188 [s] supply voltage : l/avdd[v] ta=125 b] ta= \ 40 b] ta=25 b] 220 225 230 235 240 245 250 255 260 265 270 275 280 -50 -25 0 25 50 75 100 125 150 switch strobe time(250s setting): t scan_250 [s] ambient temperature : ta[ ] l/avdd=5v l/avdd=5.25v l/avdd=4.75v 220 225 230 235 240 245 250 255 260 265 270 275 280 4.7 4.8 4.9 5.0 5.1 5.2 5.3 switch strobe time(250s setting): t scan_250 [s] supply voltage : l/avdd[v] ta=125 b] ta= \ 40 b] ta=25 b] figure 114. switch strobe time- voltage characteristic (187.5ssetting) figure 113. switch strobe time - temperature characteristic (187.5ssetting) figure 116. switch strobe time- voltage characteristic (250s setting) figure 115. switch strobe time - temperature characteristic (250s setting) datasheet d a t a s h e e t 63/72 tsz22111 ? 15 ? 001 ? 2016 rohm co., ltd. all rights reserved. www.rohm.com 19.jun.2017 rev.003 tsz02201-0e3e0hz00650-1-2 BD3375MUV-M typical performance curves - continued 0 5 10 15 20 25 30 35 40 45 50 -50 -25 0 25 50 75 100 125 150 switch input source/sink current rise time: t sr_r [s] ambient temperature : ta[ ] vpub=13v vpub=26v vpub=8v 0 5 10 15 20 25 30 35 40 45 50 5.0 10.0 15.0 20.0 25.0 30.0 switch input source/sink current rise time: t sr_r [s] supply voltage : vpub[v] ta=125 b] ta= \ 40 b] ta=25 b] 0 5 10 15 20 25 30 35 40 45 50 -50 -25 0 25 50 75 100 125 150 switch input source/sink current fall time: t sr_f [s] ambient temperature : ta[ ] vpub=13v vpub=26v vpub=8v 0 5 10 15 20 25 30 35 40 45 50 5.0 10.0 15.0 20.0 25.0 30.0 switch input source/sink current fall time: t sr_f [s] supply voltage : vpub[v] ta=125 b] ta= \ 40 b] ta=25 b] figure 118. switch input source/sink current rise time- voltage characteristic (fsq=?0?, fsqz/a/b=?0?, 10ma setting, load resistance=100 ) figure 117. switch input source/sink current rise time- temperature characteristic (fsq=?0?, fsqz/a/b=?0?, 10ma setting, load resistance=100 ) figure 120. switch input source/sink current fall time- voltage characteristic (fsq=?0?, fsqz/a/b=?0?, 10ma setting, load resistance=100 ) figure 119. switch input source/sink current fall time- temperature characteristic (fsq=?0?, fsqz/a/b=?0?, 10ma setting, load resistance=100 ) datasheet d a t a s h e e t 64/72 tsz22111 ? 15 ? 001 ? 2016 rohm co., ltd. all rights reserved. www.rohm.com 19.jun.2017 rev.003 tsz02201-0e3e0hz00650-1-2 BD3375MUV-M application circuit examples 1. example of application circu it and its external components figure 121. example of application circuit and its external components capacitor (c23, c24, c26) at powe r supply pins (vpu a, vpub, vddi) insert a 0.1f capacitor between each power supply pin (vpu a, vpub, and vddi) and ground. make sure to design the external components with sufficient margin for the intended application. it is recomme nded to use capacitors with excellent voltage and temperatur e characteristics. capacitor (c22) at ref5 in order to prevent oscillation, a capacitor needs to be placed between the ref5 output pin and ground. it is recommended to use a capacitor (electrolytic, tantalum, or ceramic of at least 4.7f). make sure that capacitance of 4.7f or higher is maintained at the intended operating supply voltage and tem perature range. temperature c hange can cause fluctuation in capacitance, which may lead to oscillation. if a ceramic capaci tor is chosen, it is recommended to use x5r, x7r, or any others with better temperature and dc biasing c haracteristics and higher voltage tolerance. capacitor(c0 to c21) at sw itch pin (inz, ina, inb) it is recommended to use at least 0.1f capacitors as protecti on against esd. make sure to des ign the external circuit with sufficient margin for the intended application. use capa citors with application specif ic voltage and temperature characteristics. resistor (r0 to r21) at sw itch pin (inz, ina, inb) choose the appropriate resistor to reduce emi noise. design t he circuit so the pin voltage does not fall below the threshold voltage defined by ground float of [load resistance] x [wetting current] (when wetting current is set to source) or voltage drop (when wetting current is set to sink) may occur. c8 vbat inz0 ina0 vpub sclk si wakeb vpua gnd intb so csb BD3375MUV-M vbat mcu vbat vbat inz7 ina7 inb0 inb5 dmux vddi vddi ref5 lvdd avdd test c25 c23 c24 c26 c22 c0 r0 c7 r7 r8 c15 r15 c16 r16 c21 r21 datasheet d a t a s h e e t 65/72 tsz22111 ? 15 ? 001 ? 2016 rohm co., ltd. all rights reserved. www.rohm.com 19.jun.2017 rev.003 tsz02201-0e3e0hz00650-1-2 BD3375MUV-M 2. example of parallel connection circuit figure 122. example of application circuit and its external components parallel connection please prepare csb terminals respectively. mosi sclk intb si1 so1 sclk1 csb1 intb1 si2 so2 sclk2 csb2 intb2 BD3375MUV-M mcu miso csb1 csb2 BD3375MUV-M datasheet d a t a s h e e t 66/72 tsz22111 ? 15 ? 001 ? 2016 rohm co., ltd. all rights reserved. www.rohm.com 19.jun.2017 rev.003 tsz02201-0e3e0hz00650-1-2 BD3375MUV-M i / o equivalence circuit type equivalence circuit type equivalence circuit a input: si, sclk (with an internal pull-down resistor) b input: csb (with an internal pull-up current source) c open-drain output: intb (with an internal pull-up resistor) d open-drain output: wakeb e switch input: inz (with an internal pull-up/down current source) f switch input: ina, inb (with an internal pull-up current source) g output: dmux h output: so ?>e>e>? ?>e>e>? datasheet d a t a s h e e t 67/72 tsz22111 ? 15 ? 001 ? 2016 rohm co., ltd. all rights reserved. www.rohm.com 19.jun.2017 rev.003 tsz02201-0e3e0hz00650-1-2 BD3375MUV-M i / o equivalence circuit type equivalence circuit type equivalence circuit i output: ref5 j input: test (with an internal pull-down resistor) datasheet d a t a s h e e t 68/72 tsz22111 ? 15 ? 001 ? 2016 rohm co., ltd. all rights reserved. www.rohm.com 19.jun.2017 rev.003 tsz02201-0e3e0hz00650-1-2 BD3375MUV-M operational notes 1. reverse connection of power supply connecting the power supply in reverse polarity can damage the ic. take precautions against reverse polarity when connecting the power supply, such as mounting an external diode between the power supply and the ic?s power supply pins. 2. power supply lines design the pcb layout pattern to provide low impedance s upply lines. separate the gro und and supply lines of the digital and analog blocks to prev ent noise in the ground and supp ly lines of the digital bloc k from affecting the analog block. furthermore, connect a capacitor to ground at all power supply pins. cons ider the effect of temperature and aging on the capacitance value when using electrolytic capacitors. 3. ground voltage except for pins the output and the input of which were designed to go below ground, ensure that no pins are at a voltage below that of the ground pin at any time, even during transient condition. 4. ground wiring pattern when using both small-signal and large-current ground traces , the two ground traces shou ld be routed separately but connected to a single ground at the refer ence point of the application board to av oid fluctuations in the small-signal ground caused by large currents. also ensure that the ground trac es of external component s do not cause variations on the ground voltage. the ground lines must be as s hort and thick as possible to reduce line impedance. 5. thermal consideration should by any chance the maximum junction temperature ra ting be exceeded the rise in te mperature of the chip may result in deterioration of the properti es of the chip. in case of exceeding this absolute maximum rating, increase the board size and copper area to prevent exceedin g the maximum junction temperature rating. 6. recommended operating conditions these conditions represent a range within which the expect ed characteristics of the ic can be approximately obtained. the electrical characteristics are guarante ed under the conditions of each parameter. 7. inrush current when power is first supplied to the ic, it is possible that the internal logic may be unstable and inrush current may flow instantaneously due to the internal powering sequence and delays, especially if the ic has more than one power supply. therefore, give special consideration to power c oupling capacitance, power wiring, width of ground wiring, and routing of connections. 8. operation under strong electromagnetic field operating the ic in the presence of a strong electromagnetic field may cause the ic to malfunction. 9. testing on application boards when testing the ic on an application board, connecting a capacitor directly to a low-impedance output pin may subject the ic to stress. always discharge capacitors comp letely after each process or step. the ic?s power supply should always be turned off completely before connecting or removing it from the test setup during the inspection process. to prevent damage fr om static discharge, ground the ic during as sembly and use similar precautions during transport and storage. 10. inter-pin short and mounting errors ensure that the direction and position are correct when mounting the ic on the pc b. incorrect mounting may result in damaging the ic. avoid nearby pins being shorted to each ot her especially to ground, power supply and output pin. inter-pin shorts could be due to many reasons such as me tal particles, water droplets (in very humid environment) and unintentional solder bridge deposited in between pins during assembly to name a few. 11. unused input pins input pins of an ic are often connected to the gate of a mos transistor. the gate has extremely high impedance and extremely low capacitance. if left unconnec ted, the electric field from the out side can easily charge it. the small charge acquired in this way is enough to produce a signifi cant effect on the conduction through the transistor and cause unexpected operation of the ic. so unless otherwise specified, unused input pins should be connected to the power supply or ground line. datasheet d a t a s h e e t 69/72 tsz22111 ? 15 ? 001 ? 2016 rohm co., ltd. all rights reserved. www.rohm.com 19.jun.2017 rev.003 tsz02201-0e3e0hz00650-1-2 BD3375MUV-M operational notes ? continued 12. regarding the input pin of the ic this monolithic ic contains p+ isolat ion and p substrate layers between adj acent elements in order to keep them isolated. p-n junctions are formed at the intersection of the p layers with the n layers of other elements, creating a parasitic diode or transistor. for example (refer to figure below): when gnd > pin a and gnd > pin b, the p-n j unction operates as a parasitic diode. when gnd > pin b, the p-n junction o perates as a parasitic transistor. parasitic diodes inevitably occur in t he structure of the ic. the operation of parasitic diodes can result in mutual interference among circuits, operational faults, or physical dam age. therefore, conditions that cause these diodes to operate, such as applying a voltage lower than the gnd voltage to an input pin (and thus to the p substrate) should be avoided. figure 123. example of monolithic ic structure 13. ceramic capacitor when using a ceramic capacitor, determine the dielectric constant considering the change of capacitance with temperature and the decrease in nominal capacitance due to dc bias and others. 14. thermal shutdown circuit(tsd) this ic has a built-in thermal shutdown circuit that prevents heat damage to t he ic. normal operation should always be within the ic?s maximum junction temperature rating. if however the rating is exceeded for a continued period, the junction temperature (tj) will rise which will activate the ts d circuit that will turn off a ll output pins. when the tj falls below the tsd threshold, the circuits are automatically restored to normal operation. note that the tsd circuit operates in a situation that exceed s the absolute maximum rati ngs and therefore, under no circumstances, should the tsd circuit be used in a set desi gn or for any purpose other t han protecting the ic from heat damage. datasheet d a t a s h e e t 70/72 tsz22111 ? 15 ? 001 ? 2016 rohm co., ltd. all rights reserved. www.rohm.com 19.jun.2017 rev.003 tsz02201-0e3e0hz00650-1-2 BD3375MUV-M ordering information b d 3 3 7 5 m u v - me 2 part number package muv: vqfn48mcv070 rank m:automotive packaging and forming specification e2:embossed tape and reel figure 124. ordering information marking diagrams (top view) figure 125. marking diagrams vqfn48mcv070 (top view) bd3375 part number marking lot numbe r 1pin mark datasheet d a t a s h e e t 71/72 tsz22111 ? 15 ? 001 ? 2016 rohm co., ltd. all rights reserved. www.rohm.com 19.jun.2017 rev.003 tsz02201-0e3e0hz00650-1-2 BD3375MUV-M physical dimensions, tape and reel information package name vqfn48mcv070 figure 126. physical dimensions, tape and reel information datasheet d a t a s h e e t 72/72 tsz22111 ? 15 ? 001 ? 2016 rohm co., ltd. all rights reserved. www.rohm.com 19.jun.2017 rev.003 tsz02201-0e3e0hz00650-1-2 BD3375MUV-M revision history date rev. history 29.jan.2016 001 (japanese only) 27.sep.2016 002 new release 19.jun.2017 003 p3 table 1 modified description of intb. p3 note 2 modified reference page p8 table 8 modified parameter of vddi operating current. p11 table 11 added note to typ value of ?source/sink current rise time?. p12 table 12 added note to typ value of ?si, csb, sclk rise time?. p20,36 changed note no. p42-50 figure 34,42,50,58,66 m odified performance curves. p67 modified equivalence circuit of ref5. notice - p a a - e rev.00 3 ? 201 5 rohm co., ltd. all rights reserved. notice precaution on using rohm products 1. if you intend to use our products in devices requiring extremely high reliability ( such as medical equipment ( n ote 1 ) , aircraft/spacecraft, nuclear power controllers, etc.) and whose malfunction or failure may cause loss of human life , bodily injury or serious damage to property ( specific applications ) , please consult with the rohm sales representative in advance. unless otherwise agreed in writing by rohm in advance, rohm shall not be in any way responsible or liable for any damages, expenses or losses incurred by you or third parties arising from the use of any rohm s products for specific applications. ( n ote1) m edical equipment classifica tion of the specific applications japan usa eu china class 2. rohm designs and manufactures its products subject to strict quality control system. however, semiconductor products can fail or malfunction at a cert ain rate. please be sure to implement, at your own responsibilities, adequate safety measures including but not limited to fail - safe design against the physical injury, damage to any property, which a failure or malfunction of our products may cause. the f ollowing are examples of safety measures: [a] installation of protection circuits or other protective devices to improve system safety [b] installation of redundant circuits to reduce the impact of single or multiple circuit failure 3. our p roducts are no t designed under any special or extraordinary environments or conditions, as exemplified below . accordingly, rohm shall not be in any way responsible or liable for any damages, expenses or losses arising from the use of any rohms p roduct s under any specia l or extraordinary environments or conditions . if you intend to use our products under any special or extraordinary environments or conditions (as exemplified below), your independent v erification and confirmation of product performance, reliability, etc, prior to use, must be necessary : [a] use of our products in any types of liquid, including water, oils, chemicals, and organic solvents [b] use of our products outdoors or in places where the p roducts are exposed to direct sunlight or dust [c] use of our products in places where the p roducts are exposed to sea wind or corrosive gases, including cl 2 , h 2 s, nh 3 , so 2 , and no 2 [d] use of our products in places where the p roducts are exposed to static electricity or electromagnetic waves [e] use of our products in proximity to heat - producing components, plastic cords, or other flammable items [f] s ealing or coating our p roducts with resin or other coating materials [g] use of our products without cleaning residue of flux (even if you use no - clean type fluxes, cle aning residue of flux is recommended); or washing our products by using water or water - soluble cleaning agents for cleaning residue after soldering [h] use of the p roducts in places subject to dew condensation 4 . the p roducts are not subject to radiation - proof design . 5 . please verify and confirm characteristics of the final or mounted products in using the products. 6 . in particular, if a transient load (a large amount of load applied in a short period of time, such as pulse. is applied, confirmation o f performance characteristics after on - board mounting is strongly recommended. avoid applying power exceeding normal rated power; exceeding the power rating under steady - state loading condition may negatively affect product performance and reliability. 7 . de - rate power dissipation d epending on a mbient temperature . when used in sealed area, confirm that it is the use in the range that does not exceed the maximum junction temperature. 8 . confirm that operation temperature is within the specified range described in the product specification. 9 . rohm shall not be in any way responsible or liable for f ailure induced under de viant condition from what is defined in this document . precaution for mounting / circuit board design 1. when a highly active halogenous (chlorine, bromine, etc.) flux is used, the residue of flux may negatively affect product performance and reliability. 2. in principle, the reflow soldering method must be used on a surface - mount products, the flow soldering method must be used on a through hole mount products. i f the flow soldering method is preferred on a surface - mount products, please consult with th e rohm representative in advance. for details , please refer to rohm mounting specification notice - p a a - e rev.00 3 ? 201 5 rohm co., ltd. all rights reserved. precautions regarding application examples and external circuits 1. if change is made to the constant of an external circuit, please allow a sufficient margin con sidering variations of the characteristics of the p roducts and external components, including transient characteristics, as well as static characteristics. 2. you agree that application notes, reference designs, and associated data and information contain ed in this document are presented only as guidance for products use . therefore, in case you use such information, you are solely responsible for it and you must exercise your own independent verification and judgment in the use of such information contain ed in this document. rohm shall not be in any way responsible or liable for any damages, expenses or losses incurred by you or third parties arising from the use of such information. precaution for electrostatic this p roduct is e lectrostatic sensitive pr oduct, which may be damaged due to e lectrostatic discharge. please take proper caution in your manufacturing process and stor age so that voltage exceeding the product s maximum rating will not be applied to p roducts. please take special care under dry condi tion (e.g. grounding of human body / equipment / solder iron, isolation from charged objects, setting of ionizer, friction prevention and temperature / humidity control). precaution for storage / transportation 1. product performance and soldered connecti ons may deteriorate if the p roducts are stored in the places where : [a] the p roducts are exposed to sea winds or corrosive gases, including cl2, h2s, nh3, so2, and no2 [b] the temperature or humidity exceeds those recommended by rohm [c] the products are e xposed to direct sunshine or condensation [d] the products are exposed to high electrostatic 2. even under rohm recommended storage condition, solderability of products out of recommended storage time period may be degraded. it is strongly recommended to confirm solderability before using p roducts of which storage time is exceeding the recommended storage time period. 3. store / transport cartons in the correct direction, which is indicated on a carton with a symbol. otherwise bent leads may occur due to excessive stress applied when dropping of a carton. 4. use p roducts within the specified time after opening a humidity barrier bag. baking is required before using p roducts of which storage time is exceeding the recommended storage time period . precaut ion for p roduct l abel a two - dimensional barcode printed on rohm p roduct s label is for rohm s internal use only . precaution for d isposition when disposing p roducts please dispose them properly using a n authorized industry waste company. precaution for foreign e xchange and foreign t rade act since concerned goods might be fallen under listed items of export control prescribed by foreign exchange and foreign trade act, please consult with rohm in case of export. precaution regarding intellectual property rights 1. all informa tion and data including but not limited to application example contained in this document is for reference only. rohm does not warrant that foregoing information or data will not infringe any intellectual property rights or any other rights of any third pa rty regarding such information or data. 2. rohm shall not have any obligations where the claims, actions or demands arising from the combination of the products with other articles such as components, circuits, systems or external equipment (including software). 3. no license, expressly or impli ed, is granted hereby under any intellectual property rights or other rights of rohm or any third parties with respect to the products or the information contained in this document. provided, however, that rohm will not assert its intellectual property rig hts or other rights against you or your customers to the extent necessary to manufacture or sell products containing the products, subject to the terms and conditions herein. other precaution 1. this document may not be reprinted or reproduced, in whole or in part, without prior written consent of rohm. 2. the pr oducts may not be disassemble d, converted, modified, reproduced or otherwise changed without prior written consent of rohm. 3. i n no event shall you use in any way whatsoever the products and the related technical information contained in the products or this document for any military purposes , including but not limited to, the development of mass - destruction weapons . 4. the proper names of companies or products described in this document are trademarks or registered trademarks of rohm, its affiliated com panies or third parties. datasheet datasheet notice ? we rev.001 ? 2015 rohm co., ltd. all rights reserved. general precaution 1. before you use our pro ducts, you are requested to care fully read this document and fully understand its contents. rohm shall n ot be in an y way responsible or liabl e for fa ilure, malfunction or acci dent arising from the use of a ny rohms products against warning, caution or note contained in this document. 2. all information contained in this docume nt is current as of the issuing date and subj ec t to change without any prior notice. before purchasing or using rohms products, please confirm the la test information with a rohm sale s representative. 3. the information contained in this doc ument is provi ded on an as is basis and rohm does not warrant that all information contained in this document is accurate an d/or error-free. rohm shall not be in an y way responsible or liable for an y damages, expenses or losses incurred b y you or third parties resulting from inaccur acy or errors of or concerning such information. |
Price & Availability of BD3375MUV-M
 |
|
|
|
|
All Rights Reserved © IC-ON-LINE 2003 - 2022 |
| [Add Bookmark] [Contact Us] [Link exchange] [Privacy policy] |
|
Mirror Sites : [www.datasheet.hk]
[www.maxim4u.com] [www.ic-on-line.cn]
[www.ic-on-line.com] [www.ic-on-line.net]
[www.alldatasheet.com.cn]
[www.gdcy.com]
[www.gdcy.net] |